A method for preparing a mask with high aperture ratio and the mask
A mask plate and aperture ratio technology, which is applied in the preparation of mask plates and the field of mask plates, can solve the problems of inability to achieve high-resolution screen evaporation and low aperture ratio, and achieve increased aperture ratio and increased aperture ratio. Aperture ratio, the effect of ensuring the deposition accuracy
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Embodiment 1
[0031] Such as figure 2 and image 3 As shown, the preparation method of a high aperture ratio mask plate related to the present invention comprises the following steps:
[0032] S1: Coating light-curing material on the surface of the mask plate, and curing the light-curing material in the main area 02 of the mask plate and the connection bridge reserved area 05 to form a low polymer, and cleaning with alcohol to remove the area to be corroded by the connection bridge 04 Light-curing materials whose surface has not been cured;
[0033] S2: Immerse the mask plate coated with low polymer prepared in step S1 into FeCl with a concentration of 80-95% 3 Solution, soaked for 30-300 seconds under the condition of energized voltage of 70-100v to remove the connecting bridge to be corroded area 04, and obtain a mask plate coated with a low polymer; the low polymer is polyimide .
[0034] S3: The mask plate coated with low polymer is placed in a solution of dimethylacetamide and soa...
Embodiment 2
[0039] Another embodiment of the present invention is as Figure 4 As shown, a method for preparing a mask plate with a high aperture ratio of the present invention comprises the following steps:
[0040] S1: Coating light-curing material on the surface of the mask plate, and curing the light-curing material in the main area 02 of the mask plate and the connection bridge reserved area 05 to form a low polymer, and cleaning with alcohol to remove the area to be corroded by the connection bridge 04 Light-curing materials whose surface has not been cured;
[0041] S3. Immerse the mask plate coated with low polymer prepared in step S1 into FeCl with a concentration of 80-95% 3 Solution, soaked for 30-300 seconds under the condition of energized voltage of 70-100v to remove the connecting bridge to be corroded area 04, and obtain a mask plate coated with a low polymer; the low polymer is polyimide .
[0042] S4: The mask plate coated with the low polymer is placed in a solution ...
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