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Modified epoxy resin and modified epoxy resin composition

A technology of epoxy resin and composition, which is applied in the field of modified epoxy resin and modified epoxy resin composition, and can solve the problems of high crosslinking density, heat resistance, poor impact resistance and flame retardancy of epoxy resin, internal high stress

Inactive Publication Date: 2015-04-08
JINAN SHENGQUAN GROUP SHARE HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high crosslinking density and large internal stress of the cured epoxy resin, it has the disadvantages of poor heat resistance, impact resistance and flame retardancy.

Method used

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  • Modified epoxy resin and modified epoxy resin composition
  • Modified epoxy resin and modified epoxy resin composition
  • Modified epoxy resin and modified epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] In a 1-liter four-neck flask equipped with a stirrer, a thermometer and a condenser, add 370g of bisphenol A diglycidyl ether and 2-isopropylimidazole accounting for 1500ppm of the total mass of the system, heat to 130°C, and blow in nitrogen After 1 hour, the temperature was raised to 175°C, and a toluene solution containing 80 g of 2,6-toluene diisocyanate was added dropwise within 2 hours. After the toluene solution of 2,6-toluene diisocyanate was added dropwise, the reaction system was kept at 175° C. for 4 hours, and then the toluene was removed to obtain 450 g of light yellow oxazolidinone-modified epoxy resin. The epoxy equivalent of the modified epoxy resin is 290g / eq, the number average molecular weight is 450g / mol, the hydrolyzed chlorine is 400ppm, and the viscosity is 950mPa.s.

Embodiment 2

[0078] In a 1-liter four-necked flask equipped with a stirrer, a thermometer and a condenser, add 370g of bisphenol A diglycidyl ether and 2-methylimidazole accounting for 1500ppm of the total mass of the system, heat to 120°C, and pass nitrogen gas for 1h , after which the temperature was raised to 180° C., and a toluene solution containing 75 g of 2,6-toluene diisocyanate was added dropwise within 2 hours. After the toluene solution of 2,6-toluene diisocyanate was added dropwise, the reaction system was kept at 180° C. for 4 hours, and then the toluene was removed to obtain 445 g of light yellow oxazolidinone-modified epoxy resin. The epoxy equivalent of the modified epoxy resin is 310g / eq, the number average molecular weight is 460g / mol, the hydrolyzed chlorine is 500ppm, and the viscosity is 2000mPa.s.

Embodiment 3

[0080] In a 1-liter four-neck flask equipped with a stirrer, a thermometer and a condenser, add 380g of bisphenol A diglycidyl ether and DBU accounting for 1500ppm of the total mass of the system, heat to 140°C, and pass nitrogen gas for 1h, then raise the temperature to At 160°C, a toluene solution containing 70g of 2,6-toluene diisocyanate was added dropwise within 1.5h. After the toluene solution of 2,6-toluene diisocyanate was added dropwise, the reaction system was kept at 160° C. for 4 hours, and then the toluene was removed to obtain 450 g of light yellow oxazolidinone-modified epoxy resin. The epoxy equivalent of the modified epoxy resin is 310g / eq, the number average molecular weight is 460g / mol, the hydrolyzed chlorine is 500ppm, and the viscosity is 2500mPa.s.

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Abstract

The application belongs to the field of synthetic resin and particularly relates to modified epoxy resin and a modified epoxy resin composition. The modified epoxy resin composition provided by the invention comprises the following components in parts by weight: 50-60 parts of modified epoxy resin, 10-30 parts of polyfunctional epoxy resin, 20-30 parts of a phosphorus-containing curing agent, 1-5 parts of a nitrogen-containing curing agent and 0.1-1 part of a curing accelerator, wherein the polyfunctional epoxy resin is one or more of o-cresol formaldehyde epoxy resin, phenol phenolic aldehyde epoxy resin, bisphenol A formaldehyde phenolic aldehyde epoxy resin, biphenyl type epoxy resin, triphenol hydroxyl methane phenolic aldehyde epoxy resin, tetraphenol hydroxyl methane phenolic aldehyde epoxy resin, tetraphenol ethane epoxy resin and phenoxy resin. Experimental results show that the modified epoxy resin composition provided by the invention has a glass-transition temperature higher than 165 DEG C and good impact toughness and meanwhile, UL-94 V0 level halogen-free flame retardancy is achieved.

Description

technical field [0001] The invention belongs to the field of synthetic resins, in particular to a modified epoxy resin and a modified epoxy resin composition. Background technique [0002] Epoxy resins refer to organic compounds containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weights are not high. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble, infusible high polymers with a three-dimensional network structure. [0003] The development of epoxy resin can be traced back to 1891, when Lindmann in Germany reacted hydroquinone and epichlorohydrin to form a resinous product. The development of epoxy resin in China began in 105...

Claims

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Application Information

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IPC IPC(8): C08G59/26C08G59/20C08G59/40C08G59/62C08G59/50C08L63/00C08L63/04
Inventor 唐一林朱红军刁兆银孟令波蔡治涛祝建勋
Owner JINAN SHENGQUAN GROUP SHARE HLDG
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