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Low-temperature seal glass material and preparation method of composite filler

一种复合填料、封接玻璃的技术，应用在玻璃生产领域，能够解决微裂纹、不利整体封接材料强度、不利OLED器件封装良率等问题，达到提高封装良率的效果

Inactive Publication Date: 2015-04-08
SHANGHAI TIANMA AM OLED +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal expansion coefficient of the sealing glass frit obtained by mixing these fillers with glass powder is difficult to control. When the sealing glass frit containing these fillers is used for the packaging of OLED devices, microcracks are likely to occur in the sealing part, which is not conducive to improving the overall sealing. strength of material
[0005] Therefore, there is a problem in the prior art that the thermal expansion coefficient of the sealing glass frit is difficult to control due to the use of negative thermal expansion materials as fillers, which is not conducive to improving the packaging yield of OLED devices.

Method used

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  • Low-temperature seal glass material and preparation method of composite filler

Examples

Experimental program
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Embodiment 1

[0028] Such as figure 2 The low-temperature sealing glass frit provided by the illustrated embodiment of the present invention includes glass frit and fillers, and the fillers at least include composite fillers. Among them, the composite filler is a negative thermal expansion composite material whose thermal expansion coefficient can be adjusted. The common glass powder is made of V2O5, TeO2, Fe2O3, Co2O3, TiO2, ZrO2, ZnO, K 2 O one or more components.

[0029] The composite filler in this example is a composite material obtained by chemical reaction of a mixture of zirconium tungstate and silicon dioxide at high temperature. Among them, zirconium tungstate is an isotropic negative thermal expansion material, and silicon dioxide is an amorphous silicon dioxide powder, which is a zero thermal expansion material. Isotropic negative thermal expansion materials will shrink in the three crystal axis directions when heated, and the shrinkage coefficient is the same, with cubic sy...

Embodiment 2

[0049] By expanding the components of the composite fillers in the above embodiments, other negative thermal expansion composite fillers with adjustable thermal expansion coefficients and low-temperature sealing glass frits with adjustable thermal expansion coefficients can be obtained. Among them, the composite filler can at least be expanded as follows according to the components:

[0050] Supplementary Example 1: The composite filler is a composite material obtained by chemically reacting a mixture of zirconium tungstate, silicon dioxide and cordierite at high temperature. The complex phase of the composite filler includes zirconium tungstate-silicon dioxide complex phase and zirconium tungstate-cordierite complex phase.

[0051] Supplementary Example 2: The composite filler is a composite material obtained by chemically reacting a mixture of zirconium tungstate, silicon dioxide and eucryptite at high temperature. The complex phase of the composite filler includes zirconiu...

Embodiment 3

[0052] Supplementary Example 3: The composite filler is a composite material obtained by chemical reaction of a mixture of zirconium tungstate, silicon dioxide, cordierite and eucryptite at high temperature. The complex phase of the composite filler includes zirconium tungstate-silicon dioxide complex phase, zirconium tungstate-cordierite complex phase and zirconium tungstate-eucryptite complex phase.

[0053] Among them, zirconium tungstate is an isotropic negative thermal expansion material, silicon dioxide is a zero thermal expansion material, and eucryptite and cordierite are anisotropic negative thermal expansion materials.

[0054] Take the composite filler of Supplementary Example 1 as an example, such as Figure 5 The specific steps for preparing the composite filler shown are:

[0055] Step 501: making a mixed wet compact from zirconium tungstate, silicon dioxide, and cordierite dissolved in an organic solvent with a set volume fraction by physical deposition;

[00...

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Abstract

The invention discloses a low-temperature seal glass material and a preparation method of a composite filler in the glass material. The low-temperature seal glass material comprises glass powder and filler, wherein the filler at least comprises composite filler which is a negative thermal expansion composite material with adjustable coefficient of thermal expansion. The coefficient of thermal expansion of the low-temperature seal glass material mixed by the composite filler and the glass powder can be adjusted, so that the coefficient of thermal expansion of the low-temperature seal glass material can be matched with that of an OLED apparatus packaging glass substrate, thereby improving the packaging yield of OLED apparatuses. The problem in the prior art that the seal glass substrate and the seal glass material sealed are distorted and cracked or the OLED seal glass substrate has cracks when the packaged OLED apparatus is under high-light exposure as the difference of coefficient of thermal expansion of the seal glass material and that of the seal glass substrate is great is solved.

Description

technical field [0001] The invention relates to the technical field of glass production, in particular to a method for preparing low-temperature sealing glass frit and composite filler. Background technique [0002] In the OLED display panel manufacturing process, in order to ensure the life of the OLED device, the organic layer in the OLED device is usually isolated from the water vapor and oxygen in the outside air. In the prior art, the upper sealing glass substrate used to encapsulate the OLED device The area to be sealed composed of the lower sealing glass substrate is filled with sealing glass frit (see figure 1 ), and then use the laser beam to move and heat the sealing glass frit, so that the glass frit is melted to realize the airtight sealing of the OLED device. The commonly used sealing glass frit is low-temperature sealing glass frit. [0003] Generally, the thermal expansion coefficient of the sealing glass substrate covering the OLED device is 30×10 -7 / °C to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24
CPCC03C8/24C03C3/12C03C8/20C08K3/22C08K3/36C08K2003/2203C08K2003/222C08K2003/2227C08K2003/2244C08K2003/2258C08K2003/2265
Inventor 李丹丹
Owner SHANGHAI TIANMA AM OLED
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