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Solder alloy, solder paste, and electronic circuit board

一种线路基板、焊锡膏的技术，应用在印刷电路、印刷电路、印刷电路制造等方向，能够解决耐疲劳性耐冷热疲劳性劣化、连接不良、降低银等问题，达到抑制气孔、确保润湿性、低成本化的效果

Inactive Publication Date: 2015-04-01
HARIMA CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, since the silver contained in the tin-silver-copper alloy is very expensive, it is required to reduce the silver content from the viewpoint of cost reduction.
However, when the silver content is simply reduced, the fatigue resistance (especially cold and heat fatigue resistance) deteriorates, which may cause poor connection, etc.

Method used

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  • Solder alloy, solder paste, and electronic circuit board
  • Solder alloy, solder paste, and electronic circuit board
  • Solder alloy, solder paste, and electronic circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～36 and comparative example 1～7

[0099] Modulation of Solder Alloy

[0100] Powders of the respective metals listed in Tables 1 to 3 were mixed according to the compounding ratios listed in Tables 1 to 3, and the obtained metal mixture was melted and homogenized in a melting furnace to prepare a solder alloy. In the compounding formulations of the solder alloys described in Tables 1 to 3, the description of tin (Sn) is omitted. The compounding ratio of Sn in the compounding formula of each embodiment and each comparative example is to subtract each metal (silver (Ag), copper (Cu), bismuth (Bi), antimony (Sb), nickel (Ni), indium (In), cobalt (Co), and germanium (Ge)) and the remainder of the compounding ratio (mass %).

Embodiment 1

[0101] In the solder alloy of Example 1, each metal of Ag, Cu, Bi, Sb, and Ni was blended in the ratio shown in Table 1, and the remainder was Sn. In Examples 2-4, In and / or Co were further compounded with respect to the formulation of Example 1.

[0102] Examples 5-10 are the examples of the formulation which changed the compounding ratio of Bi from the formulation of Example 1.

[0103] Examples 11 to 13 are examples of formulations in which the compounding ratio of Sb and the value of the mass ratio Bi / Sb of the compounded amounts of Bi and Sb are changed from the compounding ratio of Example 6.

Embodiment 14

[0104] Example 14 is an example of a formulation in which the blending ratio of Cu was changed from the formulation of Example 1.

[0105] Examples 15 to 22 are examples of formulations in which Co was further blended with respect to the formulations of Examples 6 to 9 and 11 to 14.

[0106] Examples 23 to 26, 35 and Comparative Example 2 are examples of formulations in which the compounding ratio of Sb and the value of the mass ratio Bi / Sb of the compounding amounts of Bi and Sb are changed from the formula of Example 1.

[0107] Examples 27 and 28 are examples of formulations in which the mixing ratio of Ag was changed from the formulation of Example 1.

[0108] In Examples 29 to 32, each metal of Ag, Cu, Bi, Sb, Ni, and Co was blended in the ratio shown in Table 3, and the remainder was Sn.

[0109] Examples 33 to 36 are examples of formulations in which the blending ratio of Bi and the blending ratio of Sb were changed from the blending ratio of Example 1.

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Abstract

This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, antimony, bismuth, copper, and nickel, essentially does not contain germanium, and with respect to the total quantity of solder alloy, has a silver content of 1.0-1.2 mass% exclusive, an antimony content of 0.01-10 mass% inclusive, and a bismuth content of 0.01-3.0 mass% inclusive.

Description

technical field [0001] The present invention relates to a solder alloy, a solder paste, and an electronic circuit board. Specifically, it relates to a tin-silver-copper-based solder alloy, a solder paste containing the solder alloy, and an electronic circuit board obtained using the solder paste. Background technique [0002] Generally, solder joints using solder paste are used for metal joints in electric and electronic devices, and lead-containing solder alloys have been used in such solder pastes conventionally. [0003] However, in recent years, since the use of lead has been required to be suppressed from the viewpoint of environmental burden, development of lead-free solder alloys (lead-free solder alloys) has been underway. [0004] As such lead-free solder alloys, known are, for example, tin-copper alloys, tin-silver-copper alloys, tin-bismuth alloys, tin-zinc alloys, etc., especially tin-silver-copper alloys. It is widely used due to its excellent strength. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/22C22C13/00C22C13/02H05K3/34B23K35/363
CPCB23K1/0016B23K35/0244B23K35/025B23K35/262C22C13/00C22C13/02H05K3/3463H05K3/3485B23K1/00B23K35/26H05K1/02H05K2201/2081
Inventor 今村阳司池田一辉朴锦玉竹本正
Owner HARIMA CHEM INC
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