Copper or copper alloy chemical polishing liquid and preparation method thereof

Abstract

The invention discloses a copper or copper alloy chemical polishing liquid which is prepared from 300-600ml / L of 92.5-98wt% concentrated sulfuric acid, 15-60ml / L of 50-70wt% nitric acid, 1-10g / L of benzotriazole methyl, 5-40g / L of lauryl sodium sulfate, 5-35ml / L of an OP emulsifier, 0.5-5g / L of sodium nitrite and the balance of water. The copper or copper alloy chemical polishing liquid disclosed by the invention is relatively simple in component, easy to operate and relatively small in atmosphere pollution. A component which is polished by using the chemical polishing liquid is uniform in surface, stable in chemical polishing quality and not easy to over-corrode, the production efficiency is greatly improved, and the production cost is lowered.

Description

Technical field [0001] The invention relates to a chemical polishing liquid and a preparation method thereof, in particular to a copper or copper alloy chemical polishing liquid and a preparation method thereof. Background technique [0002] At present, many professional manufacturers specializing in the production of relays produce more parts made of copper or copper alloy materials, but there has been no general bright etching solution process. Therefore, for different copper or copper alloy materials, only a special polishing process can be used. In the production process of each batch of parts, the production volume of parts of the same material is small, but the types of materials are large, which greatly reduces production efficiency, and increases production costs and sewage treatment costs. Not only that, the current chemical polishing liquid for copper or alloy contains a large amount of volatile hydrochloric acid and nitric acid, which causes serious air pollution. Al...

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Problems solved by technology

Therefore, only a special polishing process can be used for different copper or copper alloy materials.

In the production process of each batch of parts, the production volume of parts of the same material is small, but there are many types of materials, which greatly reduces production efficiency and increases production costs and sewage treatment costs.

Not only that, but the current copper or alloy chemical polishing solution contains a large amount of volatile hydrochloric acid and nitric acid, which is more serious to air pollution.

Although some chemical polishing solutions for copper and alloys use hydrogen peroxide instead of hydrochloric acid and nitric acid, which is pollution-free, and the effect of chemical polishing is also very good, but hydrogen peroxide is unstable, especially for metals such as copper dissolved in the polishing process. Ions have a strong catalytic effect on the decomposition of hydrogen peroxide. Even if a stabilizer is added to the polishing liquid, the hydrogen peroxide will be violently decomposed to make the polishing liquid invalid, which shortens the service life of the chemical polishing liquid and increases the production cost.

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