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Adhesive sealing method in LED (light-emitting diode) encapsulating process

An LED lamp packaging and sealing technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low degree of automation, low product qualification rate, etc., to improve cost performance, improve automation, improve quality and yield. Effect

Inactive Publication Date: 2015-03-11
WUXI COCIS ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The technical problem to be solved by the present invention is: to provide a sealing method in the LED lamp packaging process, which solves the problem of low product qualification rate caused by low automation in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0051] A method for sealing glue in the process of packaging LED lamps, comprising the following steps:

[0052] Step 1. Set up an infrared distance measuring sensor connected to the controller on the sealing machine;

[0053] Step 2. Obtain the depth of the LED light bowl and the diameter of the bowl through the infrared ranging sensor;

[0054] Step 3. Adjust the speed of the rollers of the sealing machine and the glue time according to the depth of the bowl, the diameter of the bowl and the pre-set parameters of the potting glue; the deeper the depth of the LED bowl, the slower the speed of the rollers of the sealing machine , on the contrary, the smaller the depth of the LED cup, the greater the speed of the rollers of the sealing machine; the glue time is 2 seconds each time;

[0055] Step 4. Adjust the distance between the bracket and the rollers of the sealing machine;

[0056] Step 5. Start the sealing machine, and perform sealing operations on the bowls and cups pla...

specific Embodiment 2

[0061] A method for sealing glue in the process of packaging LED lamps, comprising the following steps:

[0062] Step 1. Set up an infrared distance measuring sensor connected to the controller on the sealing machine;

[0063] Step 2. Obtain the depth of the LED light bowl and the diameter of the bowl through the infrared ranging sensor;

[0064] Step 3. Adjust the speed of the rollers of the sealing machine and the glue time according to the depth of the bowl, the diameter of the bowl and the pre-set parameters of the potting glue; the deeper the depth of the LED bowl, the slower the speed of the rollers of the sealing machine , Conversely, the smaller the depth of the LED bowl, the greater the speed of the rollers of the sealing machine; the glue time is 7 seconds each time;

[0065] Step 4. Adjust the distance between the bracket and the rollers of the sealing machine;

[0066] Step 5. Start the sealing machine, and perform sealing operations on the bowls and cups placed ...

specific Embodiment 3

[0071] A method for sealing glue in the process of packaging LED lamps, comprising the following steps:

[0072] Step 1. Set up an infrared distance measuring sensor connected to the controller on the sealing machine;

[0073] Step 2. Obtain the depth of the LED light bowl and the diameter of the bowl through the infrared ranging sensor;

[0074] Step 3. Adjust the speed of the rollers of the sealing machine and the glue time according to the depth of the bowl, the diameter of the bowl and the pre-set parameters of the potting glue; the deeper the depth of the LED bowl, the slower the speed of the rollers of the sealing machine , Conversely, the smaller the depth of the LED bowl, the greater the speed of the rollers of the sealing machine; the glue time is 5 seconds each time;

[0075] Step 4. Adjust the distance between the bracket and the rollers of the sealing machine;

[0076] Step 5. Start the sealing machine, and perform sealing operations on the bowls and cups placed ...

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Abstract

The invention discloses an adhesive sealing method in an LED (light-emitting diode) encapsulating process. The adhesive sealing method comprises the following steps of: firstly, arranging a distance measuring sensor connected to a controller on an adhesive sealing machine stand; then, obtaining the depth and the bowl cup mouth caliber of an LED lamp bowl cup; regulating the rotation speed and the binding time of roller wheel of the adhesive sealing machine stand according to the bowl cup depth, the bowl cup caliber and the preset adhesive filling and sealing parameters; regulating the distance between the bracket and the roller wheel of the adhesive sealing stand; and starting an adhesive sealing machine to perform adhesive sealing operation on the bowl cup on the bracket in sequence. The adhesive sealing method can be used for automatically regulating the rotation speed and the binding time of the roller wheel of the adhesive sealing stand, so that the automation degree is improved. Meanwhile, the distance between the bracket and the roller wheel and the adhesive sealing stand is automatically regulated, so that the impurities produced by grinding off the coating on the edge of the bowl cup by virtue of the roller wheel due to too short distance are avoided, and a phenomenon that the bowl cup is deformed and not adhered with the adhesive due to too long distance is avoided.

Description

technical field [0001] The invention belongs to the field of LED chip packaging, and in particular relates to a glue sealing method in the LED lamp packaging process. Background technique [0002] Under different ambient temperatures and humidity, coupled with the differences in thermal expansion and contraction of various parts of the LED lamp and internal stress, the internal bubbles will continuously affect the transmission of electrons, destroy the internal structure, and eventually paralyze the entire lighting system, resulting in leakage current. phenomenon and dead light phenomenon, therefore, special attention needs to be paid to the elimination of bubbles during the packaging process. [0003] Potting glue is an auxiliary material for LED packaging. It has high refractive index and high light transmittance. It can protect the LED chip and increase the luminous flux of the LED. It has low viscosity and is easy to degas. Good durability and reliability. [0004] Dur...

Claims

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Application Information

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IPC IPC(8): H01L33/52H01L21/66H01L21/67
CPCH01L33/52
Inventor 沈智广
Owner WUXI COCIS ELECTRONICS TECH
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