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Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging

A technology of LED packaging and epoxy resin, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of reducing the glass transition temperature of materials, affecting the performance of materials, increasing the crosslinking density of finished products, etc., to enhance the resistance to yellowing. and UV resistance, increase the glass transition temperature, and improve the effect of brittleness

Active Publication Date: 2015-03-11
无锡嘉联电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the high temperature resistance of epoxy resin, it is generally to increase the proportion of low epoxy equivalent and multifunctional epoxy resin, but this will increase the crosslinking density of the finished product and increase the stress, thus affecting the performance of the material; for To improve the low temperature resistance of epoxy resin, it is generally to add a flexible modified resin to the system. Such modified resin usually has a long chain structure, which can improve the low temperature resistance of the material after reacting into the epoxy resin structure. But this also drastically lowers the glass transition temperature of the material, limiting the application of the finished product

Method used

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  • Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging
  • Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging
  • Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] In the preparation of epoxy resin mixture raw materials, the preparation method of polyurethane modified epoxy resin A is as follows:

[0036] ①Put 200g of PPG1000 polyether polyol into the reaction kettle, dehydrate at 100-110°C and -0.95MPa for 2-3 hours until the moisture is less than 0.05%, then cool down to 70-100°C, and pour it into the reaction kettle 69.6g of TDI was put in and reacted for 2-3 hours to obtain an isocyanate-terminated prepolymer.

[0037] ②Dehydrate 375.6.0g of E-44 epoxy resin at 100-110°C and below -0.95MPa for 2-3 hours until the water content is less than 0.05%, then cool down to 70-90°C, and add 200g of E-44 epoxy resin under nitrogen protection After reacting the isocyanate-terminated prepolymer for 2-3 hours, add 3.7g of dibutyltin dilaurate as a catalyst, and continue the reaction for 0.5-1.0 hours to obtain polyurethane-modified epoxy resin A with a predetermined structure.

[0038] The experimental formula is as follows:

[0039]

...

Embodiment 2

[0046] In the preparation of epoxy resin mixture raw materials, the preparation method of polyurethane modified epoxy resin B is as follows:

[0047] ①Put a certain amount of 100g of PPG1000 and 50g of PPG3000 polyether polyol into the reaction kettle, dehydrate at 100-110°C and below -0.95MPa for 2-3 hours until the moisture is less than 0.05%, and then cool down to 70- At 100°C, 51.8g of IPDI was put into the reactor, and after 2-3 hours of reaction, an isocyanate-terminated prepolymer was obtained.

[0048] ② Dehydrate 422.8g of E-51 epoxy resin at 100-110°C and -0.95MPa for 2-3 hours until the water content is less than 0.05%, then cool down to 70-90°C, and add 160g of epoxy resin under nitrogen protection. After reacting the isocyanate prepolymer for 2-3 hours, add 4.2g of dibutyltin dilaurate as a catalyst, and continue the reaction for 0.5-1.0 hours to obtain polyurethane-modified epoxy resin B with a predetermined structure.

[0049] The experimental formula is as fol...

Embodiment 3

[0056] In the preparation of epoxy resin mixture raw materials, the preparation method of polyurethane modified epoxy resin C is as follows:

[0057] ①Put 150g of CMA-2270 polyester polyol into the reaction kettle, dehydrate at 100-110°C and below -0.95MPa for 2-3 hours until the moisture is less than 0.05%, and then cool down to 70-100°C, to the reaction 25.2 g of HDI was put into the kettle, and after 2-3 hours of reaction, an isocyanate-terminated prepolymer was obtained.

[0058] ②Dehydrate 173.5g of E-44 epoxy resin at 100-110°C and below -0.95MPa for 2-3 hours until the water content is less than 0.05%, then cool down to 70-90°C, and add 160g of epoxy resin under nitrogen protection After reacting the isocyanate prepolymer for 2-3 hours, add 1.7g of dibutyltin dilaurate as a catalyst, and continue the reaction for 0.5-1.0 hours to obtain polyurethane-modified epoxy resin C with a predetermined structure.

[0059] The experimental formula is as follows:

[0060]

[0...

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Abstract

The invention discloses a preparation method of a high-performance epoxy resin composition for LED (light-emitting diode) packaging, which comprises the steps of raw material preparation, proportional mixing, vacuum degassing and curing. In the raw material preparation step, the epoxy resin composition is composed of a component A and a component B, wherein the component A comprises an epoxy resin mixture, a defoaming agent and a color complementing agent; the epoxy resin is composed of an alicyclic epoxy resin, a hydrogenated bisphenol A epoxy resin, a bisphenol A epoxy resin and a polyurethane modified epoxy resin; the component B comprises a curing agent mixture, a modifier, an antioxidant, an ultraviolet absorbent, a light stabilizer, an accelerator and a mold release agent; and the curing agent mixture is composed of methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride. The method improves the brittleness of the epoxy resin, lowers the internal stress of the material, enhances the low-temperature resistance of the finished product, and improves the aging resistance, yellowing resistance and ultraviolet resistance of the LED product.

Description

technical field [0001] The invention relates to the field of preparation methods of high-performance epoxy resin compositions, in particular to a preparation method of high-performance epoxy resin compositions for LED packaging. Background technique [0002] LED is a solid-state semiconductor device that can convert electrical energy into light energy. It has the characteristics of energy saving, high efficiency, long service life, environmental protection, and bright colors. It is widely used in landscape and decorative lighting, display backlight, automotive lights, transportation and marine. Signal lights and various special work lighting and other fields are playing an increasingly important role in the national economy and people's livelihood. [0003] At present, the materials used for LED packaging mainly include epoxy resin and organic silica gel, both of which have high light transmission ability and long service life. In comparison, organic silica gel has better w...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/42C08G59/20C08G18/58C08G18/10H01L33/56
Inventor 刘敏卓虎陆南平周鸿飞
Owner 无锡嘉联电子材料有限公司
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