Method for pasting soft medium microwave circuits by metal pressure block splicing technology

Abstract

The invention discloses a method for pasting soft medium microwave circuits by a metal pressure block splicing technology. The method comprises the following steps: a microwave cavity and a plurality of soft medium microwave circuits are kitted according to the drawing requirements; the grounding surface of each soft medium microwave circuit is coated with a layer of conductive adhesive, and the soft medium microwave circuits are sequentially pasted to corresponding positions of the inner wall of the microwave cavity according to the drawing requirements; the upper surfaces of the pasted soft medium microwave circuits are completely covered with capacitor paper; a plurality of small metal pressure blocks of which the area is equal to that of the upper surfaces of the soft medium microwave circuits are spliced on the capacitor paper and embedded into the microwave cavity, and the small metal pressure blocks apply pressure to the capacitor paper; the microwave cavity and the small metal pressure blocks are kept unchanged in relative position and heated to cure the conductive adhesive; and cooling is carried out, and the small metal pressure blocks and the capacitor paper are removed. The problem that gaps and holes are generated between the existing soft medium microwave circuit and the adhesive layer of the inner wall of the cavity in the adhering and curing process is solved, the number of design types and design difficulty of the metal pressure blocks are reduced, and the product production cycle is shortened.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter wave assembly, and in particular relates to a method for pasting a soft dielectric microwave circuit by using a metal pressing block splicing technology. Background technique [0002] Among the materials used in microwave high-frequency circuits, soft dielectric polytetrafluoroethylene and its composite substrate have extremely low dielectric constant, small dielectric loss and low moisture absorption, making it suitable for ultra-high frequency (frequency Up to 100GHz), ultra-wideband (2 to 10 octaves) microwave and millimeter wave circuits are widely used. Today, with the further improvement of the performance of electronic machines and systems, microwave devices and their circuits are required to have higher reliability. The manufacturability of soft dielectric polytetrafluoroethylene and its composite substrate microwave circuits (such as Rogers' RT / duroid 5880 or 5870) is no...

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Problems solved by technology

[0005] The purpose of the present invention is to solve the above problems, and to provide a method for pasting soft dielectric microwave circuits using metal briquette splicing technology. The problem of gaps and cavities in the adhesive layer on the inner wall of the cavity, and reduce the design types and difficulties of the briquetting block, and shorten the production cycle of the product

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