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Heat dissipation method and equipment

A heat dissipation method and equipment technology, applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve the problems of prohibitive liquid cooling technology and insufficient boiling heat transfer performance, so as to improve heat dissipation performance and improve boiling heat exchange The effect of thermal performance

Inactive Publication Date: 2015-02-04
DAWNING INFORMATION IND BEIJING
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  • Abstract
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Problems solved by technology

Because the surface of the above-mentioned CUP cover material is not easy to generate bubbles, and the boiling heat transfer performance is not good enough, so the temperature of the CPU rises quickly after starting up, and it is easy to reach the limit temperature of the CPU, which makes most server manufacturers discouraged from liquid cooling technology.

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0029] According to an embodiment of the present invention, a heat dissipation method is provided, which can greatly improve the boiling heat transfer performance of a liquid cooling heat dissipation system.

[0030] like figure 1 As shown, the heat dissipation method according to the embodiment of the present invention includes:

[0031] Step S101, agitating the fluoride cooling liquid for absorbing the heat energy generated by the CPU through the fan arranged above the CPU cover, wherein b...

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Abstract

The invention discloses a heat dissipation method and equipment. The heat dissipation method comprises the following steps: stirring fluoride refrigerating fluid for absorbing heat energy produced by a CPU (Central Processing Unit) through a fan which is arranged on above a CPU housing, wherein the CPU housing and the fan are both immersed in the fluoride refrigerating fluid; performing heat exchange on the fluoride refrigerating fluid through the CPU housing. The surrounding refrigerating fluid is stirred through the fan to promote annihilation of bubbles on the surface of the CPU housing and production of new bubbles, so that the heat exchange performance of boiling is improved and the heat dissipation performance of the system is greatly improved.

Description

technical field [0001] The present invention relates to the field of heat dissipation systems, in particular to a heat dissipation method and equipment. Background technique [0002] Most of the computers currently in use rely on cold air to cool down the machine, but in data centers, air cooling alone is not enough to meet the heat dissipation requirements of high heat flux density servers. Water cooling or liquid cooling has two advantages: it can direct the coolant to the heat source instead of indirect cooling like air cooling; compared with air cooling, the heat transfer efficiency per unit volume is as high as 3500 times. Water-cooled radiators appeared in the market around 2008. Server giants such as HP and IBM and other companies focusing on data center technology have successively launched water-cooled heat dissipation products. [0003] From the thermal principle, evaporative cooling uses the latent heat of vaporization when the refrigerant boils to remove heat. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 王晨沈卫东吴宏杰崔新涛
Owner DAWNING INFORMATION IND BEIJING
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