A liquid cavity heat dissipation device based on pool boiling heat dissipation

Abstract

A liquid chamber heat dissipation device based on pool boiling heat dissipation includes a liquid chamber and an external heat dissipation device. The liquid chamber is composed of a bottom plate of the liquid chamber, a top plate of the liquid chamber and a heat dissipation pipe, and is filled with a phase change working fluid. The liquid phase-change working fluid absorbs the heat at the bottom of the boiling zone and undergoes boiling heat exchange to generate steam. The steam rises to the heat dissipation pipe through the through hole on the top plate of the liquid chamber, and is condensed into liquid by means of an air-cooled or water-cooled external heat sink and flows back into the liquid chamber. The compensation chamber and the liquid delivery area can effectively supply the phase change working medium to the boiling area. The invention adopts the heat exchange method of pool boiling and has strong heat dissipation capability. Compared with existing radiators designed based on steam chambers such as vapor chambers, it does not require a capillary core structure, is easy to process, and can effectively prevent internal evaporation while having a thinner thickness. It is suitable for heat dissipation of high-power heating equipment.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic devices, and relates to a heat dissipation device, in particular to a liquid cavity heat dissipation device based on pool boiling heat dissipation. Background technique [0002] With the continuous improvement of the processing technology and process level of electronic devices, electronic chips are developing towards high integration, miniaturization and high frequency, which leads to a sharp increase in the heat generation per unit area of ​​the device, and is facing increasingly severe challenges. heat dissipation problem. If this part of the heat cannot be dissipated in time, the temperature of the device will continue to rise, which will significantly reduce the operating performance of the device, and even cause permanent damage to the device. Today, a sharp increase in temperature is a major factor in the failure of electronic devices. For highly integrated devices ...

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Problems solved by technology

[0004] In order to solve technical defects such as complex internal structure and insufficient heat dissipation capacity of electronic device heat sinks in the prior art, the object of the present invention is to propose a liquid chamber (Liquid Chamber, LC) heat dissipation device heat sink based on pool boiling heat dissipation, which has The internal structure is simple, easy to process, and has a large heat dissipation capacity. The parameters of the structure can be customized according to the actual heat dissipation requirements.

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