Method for preparing high-specific-surface-area cotton-shaped super-fine silver powder and silver powder prepared with method

Abstract

The invention relates to a method for preparing high-specific-surface-area cotton-shaped super-fine silver powder and silver powder prepared with the method. The method for preparing the high-specific-surface-area cotton-shaped super-fine silver powder comprises the following steps of A, preparing a first water solution; B, preparing a second water solution; C, conducting reduction treatment; D, conducting washing; E, conducting drying and sieving, and obtaining the dried finished high-specific-surface-area cotton-shaped super-fine silver powder. According to the silver powder prepared with the method, the specific surface area is over 6.5 m<2> / g, and the burning lose content is smaller than 1.5 after heat treatment is conducted for one hour at the temperature of 538 DEG C. The method for preparing the high-specific-surface-area cotton-shaped super-fine silver powder and the silver powder prepared with the method have the advantages that the method is controlled effectively, the prepared silver powder is high in quality and stable, the production efficiency is high, pollution is avoided, the requirement for environment protection is met, after the silver power is prepared into silver paste, the viscosity and the rheological property of electrocondution slurry are maintained, the conductivity of a silver film obtained by burning the electrocondution slurry is not changed, and the proportion of the silver powder in the electrocondution slurry can be reduced. The silver powder prepared with the method has the outstanding advantages that the particle size distribution range is narrow, the dispersibility is high, the purity is high, and the specific surface area is high and is an ideal material for silver paste for electrodes of electronic components.

Description

technical field [0001] The present invention relates to the preparation method of high specific surface area flocculent ultrafine silver powder and the prepared silver powder, more specifically, the present invention relates to the preparation method of the silver powder used in the conductive silver paste in the electronic component and the prepared silver powder, especially applicable parts Including ceramic electronic components and chip electronic components, including thermistors, varistors, piezoelectric ceramic components, ceramic capacitors, chip resistors, chip antennas and ferroelectric ceramic components. Background technique [0002] In recent years, with the development of mobile Internet technology and the increasing popularity of new-generation electronic products such as smartphones and tablet computers, a new round of development of electronic components such as network information equipment, communication equipment, and voice processing equipment has been dr...

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Problems solved by technology

Although this method can obtain ultra-fine nano-copper powder, it is difficult to collect such fine powder in large-scale industrial applications. At present, the oxidation resistance of copper powder is still a problem, and the stability of the prepared copper paste cannot be achieved. Meet the requirements of a large number of high-demand electronic components, and electronic components companies need to use copper paste sintering to prepare components under an inert gas protection atmosphere, that is, compared with using silver paste, the entire production line needs to be replaced , and the price of silver has fallen back in the past two years, so the use of copper paste has no obvious cost advantage in the production of some electronic components

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