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High-density packaging substrate hole-on-disk product and preparation method thereof

A packaging substrate, high-density technology, used in the manufacture of printed circuits, the formation of electrical connection of printed components, and the electrical connection of printed components. Dimensional stability, the effect of optimizing the laser processing process

Active Publication Date: 2017-10-17
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the copper foil at the bottom of the thin copper substrate used in the MSAP process is easily penetrated during the processing process, which makes it difficult to ensure flatness, and having through holes is more likely to cause poor plating and affect product reliability.

Method used

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  • High-density packaging substrate hole-on-disk product and preparation method thereof
  • High-density packaging substrate hole-on-disk product and preparation method thereof
  • High-density packaging substrate hole-on-disk product and preparation method thereof

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Embodiment Construction

[0041] The present application will be further elaborated below in conjunction with the embodiments and the accompanying drawings.

[0042] refer to Figure 1-7 , a method for preparing a high-density packaging substrate hole-mounted product, comprising the following steps:

[0043] Cutting—baking plate—making positioning holes—removing the upper surface protective layer—laser drilling—microetching—removing the lower surface protective layer—removing glue—depositing chemical copper—MSAP process—— Electroplating and hole filling - MSAP film removal - MSAP etching - post process.

[0044] Among them, the substrate material used for cutting is such as figure 1 As shown (the thin copper substrate includes a dielectric layer 101, a copper foil 102 and a protective film layer 103). Different from the traditional copper-clad substrate material, the thickness of the substrate is 0.1mm, and the outer side of the copper foil (thickness is 2-4μm) has a layer of protective copper foil ...

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Abstract

A high-density package substrate on-hole disk product and manufacturing method thereof, the manufacturing method comprising the following steps: drying a plate, manufacturing a positioning hole, conducting laser drilling, micro-etching, copper plating and pattern transfer, electroplating for hole filling, and conducting film stripping and etching to obtain a high-density package substrate on-hole disk product. The present invention utilizes an effect of a thin copper substrate protection film layer (103), thus avoiding a problem of penetration of a bottom copper foil (102) in past machining process of thin copper, and manufacturing a complete half-through hole (107) structure on the thin copper substrate; in addition, the present invention utilizes a direct laser machining technique, thus having no effect on the thickness of the copper foil, matching well with an MSAP process, and manufacturing a high-density Flip-chip product having a highly flat on-hole disk structure.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a plate-on-hole product of a high-density packaging substrate and a preparation method thereof. Background technique [0002] As a carrier of semiconductor chips, one of the main functions of the packaging substrate is the transition structure between the chip and the circuit board. In order to meet the requirements of higher density packaging, packaging products with ultra-thin Flip-chip structure have aroused widespread interest in the industry and have developed rapidly in recent years. Compared with the traditional Wire-bonding structure, the feature of the Flip-chip structure packaging substrate is that the connection points are changed from the peripheral distribution to the planar array distribution, and the connection method with the chip is also changed from the traditional gold / copper wire to the small size solder ball. This technology of array...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/42H05K3/00
CPCH05K1/11H05K3/00H05K3/42
Inventor 王名浩谢添华李志东
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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