Fabrication of sic ultrafast recovery diode and its technology
A recovery diode, ultra-fast technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc.
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[0076] The present invention is specifically described below by the embodiment, only for further illustrating the present invention, can not be interpreted as the limitation of protection scope of the present invention, the technical engineer of this field can make some non-essential improvements and improvements to the present invention according to the content of the above-mentioned invention Adjustment.
[0077] Such as figure 1 The specific implementation steps (1) of the present invention shown, select commercial 4H-SiC epitaxial wafers, N + type substrate, the electron concentration is about 1.0×10 19 cm -3 , a thickness of 250±2μm, and the N-type epitaxial film on it, the electron concentration is about 1.0×10 17 cm -3 , the thickness is 10 μm, the deviation from the (0001) plane is 8°, and the surface micropipe density is lower than 30 μP·cm -2 . Of course, the N of 4H-c-SiC in the present invention + The electron concentration of the substrate can be in the ra...
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