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Manufacturing and processing method for direct-bonding TFT LCM

A liquid crystal display module and processing method technology, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve the problems of many bubbles, affect the display effect, and fully fit the gap, so as to achieve product adhesion of bubbles. The effect of less, simple processing flow and high alignment accuracy

Inactive Publication Date: 2014-12-03
JIANGXI HOLITECH TECH
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Problems solved by technology

This production and processing method has an assembly tolerance between TFT FOG and backlight, and a full lamination tolerance between TFT LCD module and CTP, and it is easy to form a full lamination gap, resulting in poor defoaming, which eventually leads to the assembly of TFT FOG and CTP products. The large deviation between them will affect the display effect, and there will be more bubbles, which will affect the yield of mass production

Method used

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  • Manufacturing and processing method for direct-bonding TFT LCM

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0019] Such as figure 1 As shown, the present invention is realized in this way, a kind of production and processing method of fully bonding TFT liquid crystal display module, the TFT LCM in the fully bonding module does not assemble the backlight first, and the FOG in the TFT LCM is first on the surface of the upper polarizer Lay OCA optical glue, pre-baked, pressurized and degassed, use a jig to pre-laminate CTP and FOG, use a laminating machine for lamination, and heat through a degassing furnace After pressure defoaming, use the jig to assemble the backlight.

[0020] Specifically, the TFT LCM part does not assemble the backlight first, and the FOG 3 is attached with OCA2 glue first.

[0021] Specifically, after the TFT LCM FOG 3 is bonded to the OCA2, the degassing oper...

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Abstract

The invention provides a manufacturing and processing method for a direct-bonding TFT LCM (Liquid Crystal Module), and belongs to the technical field of direct-bonding module processing. The realization process of the manufacturing and processing method is as follows: not assembling backlight on TFT LCM in a direct-bonding module, and gluing OCA on the surface of an up polarizer of FOG in the TFT LCM; after pre-baking and pressurizing for defoaming, using a jig to carry out aligned pre-gluing processing on CTP and FOG; adopting a gluing machine for pressing operation; reusing the jig to assemble backlight after warming and pressurizing for defoaming through a defoaming furnace. The manufacturing and processing method has the advantages that direct-bonding products processed by adopting the method has the advantages of being simple in processing process, high in alignment precision, less in foams in product gluing, high in yield and the like.

Description

technical field [0001] The invention belongs to the processing technology of fully laminating modules, and in particular relates to a production and processing method of fully laminating TFT liquid crystal display modules. Background technique [0002] With the improvement of living standards, one of the development trends of color display modules is to develop towards the direction of full-fit TFT liquid crystal display modules. For ordinary suppliers, because CTP and TFT LCD modules are not produced by the same supplier, generally FOG is first assembled with backlight to form a TFT LCD module, and then assembled with CTP after bonding OCA glue. This production and processing method has an assembly tolerance between TFT FOG and backlight, and a full lamination tolerance between TFT LCD module and CTP, and it is easy to form a full lamination gap, resulting in poor defoaming, which eventually leads to the assembly of TFT FOG and CTP products. If there is a large deviation b...

Claims

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Application Information

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IPC IPC(8): G02F1/13B32B37/10
Inventor 王刚
Owner JIANGXI HOLITECH TECH
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