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Polycrystalline silicon battery chip corrosion solution and preparation process thereof

A technology of polysilicon battery and corrosion solution, which is applied in the directions of crystal growth, post-processing details, and post-processing, etc. It can solve problems such as difficulties in large-scale production, difficult control of product quality repeatability, and increased process costs. The effect of clean surface, uniform and slow reaction

Inactive Publication Date: 2014-11-05
无锡尚品太阳能电力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The biggest disadvantage of acid corrosion on silicon wafers is the self-catalysis of the reaction, and the reproducibility of product quality is difficult to control, which will undoubtedly bring great difficulties to large-scale production
In the actual process of industrial production, technicians control the reaction by adding cooling devices, circulation devices and other auxiliary devices, which increases the process cost

Method used

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  • Polycrystalline silicon battery chip corrosion solution and preparation process thereof
  • Polycrystalline silicon battery chip corrosion solution and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Embodiment 1: A preparation process of polycrystalline silicon cell corrosion solution, including the following steps, the component ratio is counted in parts by weight: inject 66 parts of water into the texturing tank and cool down to 12°C, add 10 parts of hydrofluoric acid, 80 1 part nitric acid and 1 part texturizing auxiliary agent; pass nitrogen gas into bubbles, and at the same time cool down with refrigerated water circulation to ensure that the temperature is at 5°C to obtain the corrosive liquid; wherein, the flow rate of nitrogen gas is 5L / min, and the temperature of circulating refrigerated water is 0°C.

[0011] When using the obtained etching note, take 200 pieces of P-type doped polysilicon wafers with a size of 156cm×156cm and a thickness of 200±20μm, weigh them with a balance, put them into the prepared etching solution, and react in 350 seconds. The best surface effect, the surface is clean, the grain boundaries are fuzzy, basically no black silk spots,...

Embodiment 2

[0012] Embodiment 2: A preparation process of polycrystalline silicon cell corrosion solution, including the following steps, the component ratio is counted in parts by weight: inject 66 parts of water into the texturing tank and cool it down to 15°C, add 12 parts of hydrofluoric acid, 82 1 part nitric acid and 3 parts of texturizing auxiliary agent; pass into nitrogen bubble, at the same time cool down with refrigerated water circulation, ensure that the temperature is at 8 ℃, obtain described corrosive liquid; Wherein, nitrogen gas flow rate is 15L / min, and the temperature of circulating refrigerated water is 4°C.

[0013] When using the obtained etching note, 200 pieces of P-type doped polysilicon wafers with a size of 156cm×156cm and a thickness of 200±20μm were weighed with a balance, and then put into the prepared etching solution for reaction. It took 340 seconds to reach The best surface effect, the surface is clean, the grain boundaries are fuzzy, basically no black s...

Embodiment 3

[0014] Embodiment 3: A preparation process of polycrystalline silicon cell corrosion solution, including the following steps, the component ratio is counted in parts by weight: inject 66 parts of water into the texturing tank and cool down to 13 ° C, add 11 parts of hydrofluoric acid, 81 1 part nitric acid and 2 parts texturizing auxiliary agent; pass into nitrogen bubbles, and at the same time cool down with refrigerated water circulation, guarantee the temperature at 6 ℃, obtain described corrosive liquid; Wherein, nitrogen gas flow rate is 10L / min, and the temperature of circulating refrigerated water is 2°C.

[0015] When using the obtained etching note, take 200 pieces of P-type doped polysilicon wafers with a size of 156cm×156cm and a thickness of 200±20μm, weigh them with a balance, put them into the prepared etching solution, and react in 330 seconds. The best surface effect, the surface is clean, the grain boundaries are fuzzy, basically no black silk spots, and the s...

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Abstract

The invention relates to a polycrystalline silicon battery chip corrosion solution and a preparation process thereof. The polycrystalline silicon battery chip corrosion solution comprises the following components in parts by weight: 10-12 parts of hydrofluoric acid, 80-82 parts of nitric acid, 1-3 parts of texturing aid and 66 parts of water, wherein the mass percentage concentration of the hydrofluoric acid is 49+ / -1%, and the mass percentage concentration of the nitric acid is 78+ / -1%. The preparation process for the polycrystalline silicon battery chip corrosion solution is characterized by comprising the steps of injecting 66 parts by weight of water into a texturing tank, cooling the water to 12-15 DEG C, and adding 10-12 parts by weight of hydrofluoric acid, 80-82 parts by weight of nitric acid and 1-3 parts by weight of texturing aid; introducing nitrogen for bubbling, meanwhile, circularly cooling with chilled water to keep the temperature at 5-8 DEG C to obtain the corrosion solution; wherein the flow rate of the nitrogen is 5-15L / min, and the temperature of the circular chilled water is 0-4 DEG C. By adopting the corrosion solution disclosed by the invention, the speed of reaction between a silicon chip and the acidic corrosion solution is easy to control, and a uniform surface morphology structure can be formed.

Description

technical field [0001] The invention relates to a polycrystalline silicon solar cell corrosion solution and a preparation process thereof, belonging to the technical field of photovoltaics. Background technique [0002] Energy is the basis for the development of human society, and the environment is a necessary condition for the sustainable development of human beings. Traditional energy sources are increasingly tense, and people are constantly looking for new clean energy sources. All kinds of new energy have their advantages and disadvantages. Photovoltaic power generation, as a branch of new energy, has attracted more and more attention. In recent years, the output of solar cells has grown at an unprecedented rate, and crystalline silicon cells still occupy the mainstream of the market. Since polycrystalline silicon materials were used to replace monocrystalline silicon to reduce the cost of crystalline silicon solar cells, attempts to prepare high-quality textured stru...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B33/10C23F1/24
Inventor 杜正兴陈烈军丁志强
Owner 无锡尚品太阳能电力科技有限公司
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