Optical coupling apparatus for packaging optoelectronic integration array chip

Abstract

The invention discloses an optical coupling apparatus for packaging an optoelectronic integration array chip. The optical coupling apparatus comprises a tube shell or a heat sink, the semiconductor optoelectronic integration array chip, a semiconductor optoelectronic integration array chip substrate, an optical collimating lens array, a beam splitter prism, a beam splitter prism bracket, detector array chips, an optical focusing lens array, a fiber array, and a fiber array bracket. According to the optical coupling apparatus for packaging the optoelectronic integration array chip, by means of installation of the beam splitter prism, partial optical signals output by the semiconductor optoelectronic integration array chip collimated by the optical collimating lens array are introduced into the respective corresponding detector array chips, so that difficulties that a backlight detector cannot be placed due to complicated microwave micro-strip circuits or the requirement for double-end optical coupling in coupling packaging of the semiconductor optoelectronic integration array chip are overcome, and real-time monitoring of optical signals of the semiconductor optoelectronic integration array chip is achieved.

Description

technical field [0001] The invention belongs to the technical field of microwave photonics and optical communication, and more specifically relates to an optical coupling device applied to semiconductor optoelectronic integrated array chip packaging. Background technique [0002] Optoelectronics integration technology is the most cutting-edge and promising field of optical fiber communication, and it is the main technology in the future high-speed and large-capacity information network system. Compared with traditional discrete devices, photonic integrated chips reduce cost and complexity, so a new network structure with more nodes can be built at a lower cost. [0003] The monolithic integrated multi-wavelength laser array chip is the core of realizing high-speed data transmission, and the coupling packaging of the monolithic integrated multi-wavelength laser array chip is particularly important. Usually, it is necessary to install a detector on the back of the semiconduct...

AI Technical Summary

Problems solved by technology

For some specific cases, in order to meet the high-frequency performance required by communication, a complex microwave microstrip circuit is placed on the back of the monolithic integrated multi-wavelength laser array chip, and there is not enough space to place a backlight detector.

If the microwave microstrip circuit is re-arranged, not only is the process complicated, but it also has a great impact on the high-frequency performance of the packaged monolithic integrated multi-wavelength laser array chip

In addition, for semiconductor optoelectronic device array chips that require double-ended coupling, such as optical modulator array chips, semiconductor optical amplifier array chips, etc., the scheme of arranging backlight detectors is no longer applicable.

Images