Wafer purifying equipment for eliminating etching byproduct coagulation defect of connecting hole

A technology for purifying equipment and by-products, applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as difficult cleaning, impure removal of defects, and reduced productivity, achieving a large process window and eliminating condensation Defects, the effect of ensuring productivity

Active Publication Date: 2014-10-08
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method will also reduce productivity, and it is difficult to clean
If the above two methods are applied together, not only will the impact on productivity be doubled, but there will also be potential problems such as damage to CDs, and the risk of unclean removal of defects
Therefore, the above methods of removing the by-products after etching all have great disadvantages.

Method used

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  • Wafer purifying equipment for eliminating etching byproduct coagulation defect of connecting hole
  • Wafer purifying equipment for eliminating etching byproduct coagulation defect of connecting hole
  • Wafer purifying equipment for eliminating etching byproduct coagulation defect of connecting hole

Examples

Experimental program
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Effect test

Embodiment 1

[0029] In this example, see figure 1 , figure 1 It is a structural schematic diagram of a wafer cleaning device for eliminating condensation defects of connection hole etching by-products according to the present invention. The wafer purification equipment of the present invention is used to perform pre-purification treatment on the wafer after the connection hole is etched and before the wafer is cleaned, so as to remove the etching by-products adhered to the wafer, so as to eliminate the etching by-products Condensation defects caused by reaction with water. The wafer purification equipment of the present invention includes several components including a cavity, a spray gun, a wafer support table and an exhaust pipe. Such as figure 1 As shown, the chamber 1 forms a closed space for cleaning the wafer 19 , and the chamber 1 has a dome-shaped upper inner wall 8 . Utilizing the guiding effect of the arc surface of the dome, the purified gas in the cavity 1 and the etching b...

Embodiment 2

[0038] In this example, see image 3 , image 3 It is another structural schematic diagram of a wafer cleaning device for eliminating condensation defects of connection hole etching by-products of the present invention. Such as image 3 As shown, the main structure of the wafer cleaning equipment in this embodiment is exactly the same as in Embodiment 1, the only difference is that no gas agitation device is provided in the nozzles of the top spray gun 11 and the side wall spray gun 18, but in The injection ports of the top injection gun 11 and the side wall injection gun 18 are each provided with a nozzle 28, through which the injection form and outlet pressure of the purified gas can be adjusted. In this embodiment, the nozzle 28 adopts a shower-shaped spout (the spout is the same as a common shower, and the drawing is omitted). The shower-shaped nozzle can divide the purification gas into multiple bundles of pressurized jets to the wafer 19, while expanding the direct sc...

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PUM

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Abstract

The invention discloses wafer purifying equipment for eliminating an etching byproduct coagulation defect of a connecting hole. The wafer purifying equipment is used for purifying a wafer after connecting hole etching is carried out on the wafer and before cleaning, spraying guns are arranged in a cavity of the wafer purifying equipment in different directions, and can simultaneously spray purifying gas to the wafer on a rotating wafer supporting platform, a dome-shaped exhaust pipe above the cavity and in the center of the inner wall exhausts the purified gas and etching byproducts carried by the purified gas in the cavity, and the purifying effect can be further improved through a gas stirring device or spraying nozzle arranged on each spraying gun. The wafer purifying equipment not only avoids damage to the wafer, especially for a CD, but also can eliminate etching byproducts attached to the wafer, thereby eliminating the coagulation defect generated by reaction of the etching byproducts and water when the etching byproducts wait to be cleaned.

Description

technical field [0001] The present invention relates to a kind of equipment for purifying semiconductor wafer, more specifically, relates to a kind of equipment used to eliminate the condensation defect of the by-product of connection hole etching after the connection hole etching process and before the cleaning process of the semiconductor wafer wafer purification equipment. Background technique [0002] With the development of semiconductor integrated circuit technology and the scaling down of critical dimensions, semiconductor technology production will use more and more advanced processes. For example, for the connection hole etching process, the most advanced APF (advanced pattern film, advanced pattern film) process will be applied. At the same time, due to the reduction of CD, the etching reactants used will be more complex, and the composition of the by-products of etching poses a greater challenge to the subsequent cleaning process. For example, the etching by-pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67051
Inventor 范荣伟陈宏璘龙吟顾晓芳王恺
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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