Glass frit composition, glass frit paste composition, sealing method, and electric device
A technology for electrical devices and compositions, which is applied in the fields of glass frit compositions, electrical devices, and glass frit paste compositions, and can solve problems such as lower packaging yield, easy cracking, and inability to seal air bubbles, so as to reduce porosity efficiency, avoid cracking, and improve package stability
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Embodiment 1
[0046] The first embodiment of the present invention provides a glass frit composition including a glass frit substrate and a filler, and the filler includes a quasicrystalline material.
[0047] The quasicrystalline material is Al-transition metal, including Al x Cu y Fe z , Al x Cu y Co z ,, Al x Cu y Mn z , Al x Mn y Si z , Al x Mn y Fe z , Al x Mn y Zr z , Al x' Mn y' Sn z' Mn w' , Where the relationship between x, y and z satisfies:
[0048] x+y+z=100, and
[0049] 60
[0050] 5
[0051] 5
[0052] The relationship between x', y', z'and w':
[0053] x'+y'+z'+w'=100, and
[0054] 60
[0055] 5
[0056] 5
[0057] 5
[0058] Further preferably, the quasicrystalline material is Al 65 Cu 20 Fe 15 , Al 65 Cu 15 Co 20 , Al 65 Cu 20 Mn 15 At least one material in.
[0059] The crystal structure of the quasicrystalline particles of the quasicrystalline material is: 5 times, 8 times, 10 times, 12 times and other rotational symmetry, with s...
Embodiment 2
[0063] The second embodiment of the present invention also provides a glass frit paste composition, including any one of the above-mentioned glass frit compositions. The glass frit paste composition further includes an organic binder and a solvent.
[0064] In the present invention, the above-mentioned glass frit paste composition can be used to airtightly seal electrical components such as organic light-emitting display panels, light-emitting diode (LED) lighting fixtures or dye-sensitized solar cells (DSSC). In the glass frit paste composition, the glass frit substrate is a supporting material, and the filler is a material used to improve the physical and chemical properties of the glass frit composition, just like the quasicrystalline material of the present invention can improve the glass frit composition Because the glass frit substrate is in powder form and the filler is granular, the glass frit substrate and the filler are mixed, the two cannot be bonded together, and the ...
Embodiment 3
[0068] Based on the glass frit paste composition provided in the above embodiments, the third embodiment of the present invention also provides a method for sealing using the glass frit paste composition, such as Figure 4 As shown, including the following steps:
[0069] Step 1. Provide a first substrate, wherein the first substrate is provided with a glass frit paste composition.
[0070] Wherein, the glass frit paste composition on the first substrate is the glass frit paste composition provided in the above embodiments. Specific as Figure 5 The illustrated top view of the first substrate provided by the embodiment of the present invention includes a first substrate 10 on which an encapsulation area 11 and electrical components 13 are provided, and the frit paste composition is deposited on the first substrate 10's package area 11. Specifically, the glass frit paste composition can be deposited on the packaging area 11 of the first substrate 10 by dispensing or screen printing...
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Abstract
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