Semiconductor device manufacturing method, and adhesive film used in semiconductor device manufacturing method
A manufacturing method and adhesive film technology, which are applied in semiconductor/solid-state device manufacturing, film/sheet without carrier, semiconductor devices, etc., can solve problems such as inability to properly cut off the die-bonding sheet, inability to peel off the chip-bonding sheet, etc., and achieve suppression Adhesion to the chip surface and the effect of reducing the amount of debris
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Embodiment 1
[0155] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.
[0156] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)
[0157] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 32 parts
[0158] (c) 34 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)
[0159] (d) 90 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)
[0160] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, an adhesive film A having a thickness of 25 μm in Example 1 was obtained.
Embodiment 2
[0162] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.
[0163] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)
[0164] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 12 parts
[0165] (c) 13 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)
[0166] (d) 188 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)
[0167] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, the adhesive film B of Example 2 having a thickness of 25 μm was obtained.
Embodiment 3
[0169] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.
[0170] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)
[0171] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 21 parts
[0172] (c) 22 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)
[0173] (d) 77 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)
[0174] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, an adhesive film C having a thickness of 25 μm in Example 3 was obtained.
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