Distributed parallel computing method and system for physical implementation of large scale integrated circuit

Abstract

The invention discloses a distributed parallel computing method and system for physical implementation of a large scale integrated circuit. According to the method, physical design problems of different stages are divided into sub-problems on a host, different division methods are applied to the different stages, then the sub-problems are sent to distributed servers by the host in a network communication mode to be computed, and computing results are sent back to the host. The host and a computing cluster are respectively provided with a servo management program, the program is an impotent component of a distributed computing frame and is in charge of management of distributed computing resources, and management of the distributed computing resources comprises resource allocation, resource recovery and the like. According to the distributed parallel computing method and system for physical implementation of the large scale integrated circuit, the physical design problems of a super-large scale integrated circuit can be solved rapidly and effectively, physical design efficiency of the integrated circuit can be improved greatly, and rapider and more-effective physical design of the large scale integrated circuit can be achieved compared with multithreading computing on a single computer.

Description

Technical field [0001] The invention belongs to the field of integrated circuit design, in particular to the technical category of integrated circuit design optimization under an integrated circuit manufacturing process with an interconnect line width of 65nm and below, and specifically relates to a distributed parallel computing that is physically realized by a large-scale integrated circuit Method and system. Background technique [0002] The integrated circuit is designed by the designer with the help of electronic design automation (EDA) tools to design the integrated circuit layout and deliver it to the integrated circuit manufacturer, through the circuit mask preparation (Mask) and the wafer (Wafer) for oxidation, doping, lithography, etc. A series of manufacturing processes transfer the circuit mask to the wafer to realize its circuit function. For digital circuit design, the layout design process includes steps such as behavior-level synthesis, logic synthesis, physical ...

AI Technical Summary

Problems solved by technology

Due to the reduction of feature size, the number of transistors that can be accommodated on the chip increases accordingly, and the problem scale and complexity of circuit design also continue to increase, which makes traditional physical implementation tools must have the ability to deal with larger-scale and complex problems

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