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Graphene composite copper thick film conductive slurry and preparation method thereof

A graphene composite, conductive paste technology, used in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. and other problems, to achieve the effects of excellent electrical properties and adhesion, convenient operation and easy coating

Inactive Publication Date: 2014-09-03
XI'AN POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditionally, the conductive paste composed of noble metal silver with excellent conductivity is used, but silver is expensive and it is difficult to meet the low-cost requirements. Therefore, people try to use lower-cost materials such as copper to replace silver, but due to its low oxidation stability Due to the high electrical resistance after sintering, there are some problems in the process of preparing the paste, especially the electrical conductivity of the electronic paste sintered at low temperature is often affected, so there is an urgent need for an electronic paste that still has excellent electrical properties at low temperature sintering. cheap conductive paste

Method used

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Examples

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Effect test

preparation example Construction

[0035] The preparation method of above-mentioned conductive paste, comprises the following steps:

[0036] Step 1: Take copper powder with a particle size of 3-25 μm and copper powder with a particle size of 0.5-5 μm, wash with dilute hydrochloric acid with a volume concentration of 8-13%, wash with water, and wash with ethanol, and then add copper powder with a volume of 1 ~1.5 times the antioxidant is stirred evenly, and the antioxidant is any one of tributyl phosphate, oleic acid or lactic acid, and dried at a temperature of 90 ° C to 100 ° C for 2 to 3 hours in an ammonia or nitrogen atmosphere to obtain Copper powder coated with antioxidant, grind the copper powder coated with antioxidant with a particle size of 3-25 μm to obtain flake copper powder, and the copper powder coated with antioxidant with a particle size of 0.5-5 μm is spherical copper powder ;

[0037] Step 2: Weigh the raw materials of the conductive phase according to the mass percentage: 63% to 88% of fla...

Embodiment 1

[0054] Step 1: Take copper powder with a particle size of 3 μm and a copper powder with a particle size of 0.5 μm, respectively, wash with dilute hydrochloric acid with a volume concentration of 8%, wash with water, and wash with absolute ethanol, and then add phosphoric acid triphosphate equal to the volume of the copper powder. Butyl ester was dried at 100°C for 2 hours in an ammonia atmosphere to obtain copper powders coated with tributyl phosphate with a particle size of 3 μm and 0.5 μm, respectively. The particle size coated with tributyl phosphate was 3 μm copper powder is ground to obtain flaky copper powder, and the copper powder coated with tributyl phosphate with a particle size of 0.5 μm is spherical copper powder;

[0055] Step 2: Weigh the raw materials of the conductive phase: 63g of flake copper powder, 35g of spherical copper powder, and 2g of graphene powder with a particle size of 0.5nm;

[0056] Weigh each raw material of bismuth oxide low melting point glas...

Embodiment 2

[0063] Step 1: Take copper powder with a particle size of 15 μm and a copper powder with a particle size of 3 μm, respectively, wash them with dilute hydrochloric acid with a volume concentration of 10%, wash them with water, and wash them with absolute ethanol, and then add oleic acid that is 1.5 times the volume of the copper powders , dried at 90°C for 3 hours in a nitrogen atmosphere to obtain copper powders with a particle size of 15 μm and a particle size of 3 μm coated with oleic acid, respectively, and grind the copper powder with a particle size of 15 μm coated with oleic acid Obtain flaky copper powder, the copper powder coated with oleic acid with a particle size of 3 μm is spherical copper powder;

[0064] Step 2: Weigh the raw materials of the conductive phase: 88g of flake copper powder, 10g of spherical copper powder, 2g of graphene powder with a particle size of 0.5nm, and 0.4g of polyvinylpyrrolidone;

[0065] Weigh the raw materials of bismuth oxide low-melti...

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Abstract

The invention discloses graphene composite copper thick film conductive slurry. The graphene composite copper thick film conductive slurry comprises the following components in percentage by mass: 60%-80% of conductive phase, 0.5%-5% of glass phase, 15%-39.5% of organic carrier, totaling 100%. The preparation method comprises the steps of mixing the components, heating to 35-40 DEG C, and uniformly stirring. According to the graphene composite copper thick film conductive slurry disclosed by the invention, by adding graphene with an excellent conductive property, the conductive property of the slurry is improved; by bismuth oxide low-melting glass, the conductive thick film slurry has excellent electrical properties and adhesion force even when being sintered at a low temperature. The slurry has the advantages of good conductivity and small printing thickness, can be effectively applied to production of a conductive material for various products, has the advantages of simple preparation process, convenience in operation, good conductivity, uniform distribution of particle sizes and easiness in coating, and is suitable for mass production of enterprises.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and the invention relates to a graphene composite copper thick film conductive paste, and also relates to a preparation method of the conductive paste. Background technique [0002] In recent years, electronic paste has been widely used in various fields of the electronic industry. With the rapid development of the electronic industry, the demand for electronic paste is gradually increasing. Traditionally, the conductive paste composed of noble metal silver with excellent conductivity is used, but silver is expensive and it is difficult to meet the low-cost requirements. Therefore, people try to use lower-cost materials such as copper to replace silver, but due to its low oxidation stability Due to the high electrical resistance after sintering, there are some problems in the process of preparing the paste, especially the electrical conductivity of the electronic paste sintered at low te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 屈银虎蒙青
Owner XI'AN POLYTECHNIC UNIVERSITY
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