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Non-toxic water-based microcapsule mold-proof heat insulation coating and preparation method thereof

A thermal insulation coating and microcapsule technology, which is applied in the direction of microcapsule preparation, microsphere preparation, antifouling/underwater coating, etc., can solve the problems of short validity period, no heat insulation, poor water resistance, etc., and achieve extended use Longevity, low price, enhanced anti-mold effect

Active Publication Date: 2014-09-03
DALIAN XINE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical gist of the present invention is: use silicone-modified acrylate self-emulsifying emulsion as the base material, and the emulsion must be prepared under the composite emulsification system composed of anionic reactive emulsifier and non-ionic reactive emulsifier; the filler adopts rutile titanium dioxide, Light calcium carbonate, water-based airgel, yttrium oxide, bentonite, calcined kaolin, diatomaceous earth, talcum powder; non-toxic antifungal agent microcapsules with epoxy menadione and other lipophilic antifouling agents as capsule cores, polyacrylic acid The ester is the capsule wall, which ensures the long-term uniform and effective exudation of the anti-mold agent, and overcomes the shortcomings of traditional anti-mold coatings such as poor water resistance, easy peeling, short validity period, and no heat insulation effect.

Method used

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  • Non-toxic water-based microcapsule mold-proof heat insulation coating and preparation method thereof
  • Non-toxic water-based microcapsule mold-proof heat insulation coating and preparation method thereof
  • Non-toxic water-based microcapsule mold-proof heat insulation coating and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Take the following ingredients:

[0031] (1) Silicone-modified acrylate self-emulsifying emulsion, the number of parts by mass of which is 50 parts;

[0032] (2) nontoxic antifungal agent microcapsules, its mass parts are 10 parts;

[0033] The preparation method of described nontoxic antifungal agent microcapsules is as follows:

[0034] The mass number of lipophilic antifouling agents such as menadione epoxy is 5 parts, the mass number of methyl methacrylate is 130 parts; the mass number of butyl acrylate is 140 parts, and the mass number of acrylic acid is 3 parts Parts, the mass fraction of sodium lauryl sulfate is 1 part, the mass fraction of phenol polyoxyethylene ether is 1 part, the mass fraction of acetone is 15 parts, the mass fraction of potassium persulfate is 1 part, deionized water The mass parts number is 300 parts. First mix 5 parts of epoxy menadione and other lipophilic antifouling agents with 15 parts of acetone to obtain an acetone solution of epo...

Embodiment 2

[0042] Take the following ingredients:

[0043] (1) Silicone modified acrylate self-emulsifying emulsion, the number of parts by mass is 70 parts;

[0044] (2) nontoxic antifungal agent microcapsules, its mass parts are 16 parts;

[0045]The preparation method of described nontoxic antifungal agent microcapsules is as follows:

[0046] The mass number of lipophilic antifouling agents such as menadione epoxy is 15 parts, the mass number of methyl methacrylate is 180 parts; the mass number of butyl acrylate is 190 parts, and the mass number of acrylic acid is 5 parts Parts, the mass fraction of sodium lauryl sulfate is 3 parts, the mass fraction of phenol polyoxyethylene ether is 3 parts, the mass fraction of acetone is 50 parts, the mass fraction of potassium persulfate is 2 parts, deionized water The number of mass parts is 500 parts. First mix 15 parts of epoxy menadione and other lipophilic antifouling agents with 50 parts of acetone to obtain an acetone solution of epoxy...

Embodiment 3

[0054] Take the following ingredients:

[0055] (1) Silicone modified acrylate self-emulsifying emulsion, the number of parts by mass is 90 parts;

[0056] (2) nontoxic antifungal agent microcapsules, its mass fraction is 28 parts;

[0057] The preparation method of described nontoxic antifungal agent microcapsules is as follows:

[0058] The mass number of lipophilic antifouling agents such as menadione epoxy is 20 parts, the mass number of methyl methacrylate is 220 parts; the mass number of butyl acrylate is 230 parts, and the mass number of acrylic acid is 9 parts Parts, the mass fraction of sodium lauryl sulfate is 5 parts, the mass fraction of phenol polyoxyethylene ether is 5 parts, the mass fraction of acetone is 100 parts, the mass fraction of potassium persulfate is 3 parts, deionized water The mass parts number is 700 parts. First mix 20 parts of epoxy menadione and other lipophilic antifouling agents with 100 parts of acetone to obtain an acetone solution of epo...

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Abstract

The invention provides a non-toxic water-based microcapsule mold-proof heat insulation coating and a preparation method thereof and relates to the field of mold-proof heat insulation coatings. The mold-proof heat insulation coating mainly consists of organosilicone modified acrylate self-emulsifying emulsion, non-toxic mildew preventive microcapsules, fillers, aids and deionized water, wherein in the non-toxic mildew preventive microcapsules, epoxy menadione and other oleophilic anti-fouling compositions are taken as capsule cores, and polyacrylate serves as a capsule wall; the mildew preventive uniformly and effectively diffuses for a long time. The water-based microcapsule mold-proof coating adopts a non-toxic environment-friendly mold-proof heat insulation material, is non-toxic, has obvious mold-proof heat insulation effects, has service life longer than that of a traditional mold-proof coating and has excellent physical performances such as high washing resistance, high adhesive force and high impact resistance.

Description

technical field [0001] The invention relates to the field of mildew-proof and heat-preserving coatings, in particular to a non-toxic water-based microcapsule mildew-proof and heat-preserving paint and a preparation method thereof. Background technique [0002] In the hot and humid climate in the south and north in summer, the surface of ordinary walls not only grows and reproduces mold because of the hot and humid environment, but also requires a lot of air conditioning energy consumption due to the hot climate. If these places are painted with ordinary decorative paint, it will not be effective The function of thermal insulation, at the same time, the wall is also subject to different degrees of mold erosion, and mold is particularly corrosive to organic coatings. After being eroded by mold, the coating will fade, stain, or even fall off, because mold erodes the coating Finally, enzymes that can further decompose the organic film-forming substances in the coating will be se...

Claims

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Application Information

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IPC IPC(8): C09D133/12C09D5/14C09D7/12C08F220/14C08F220/18C08F220/06C08F230/08B01J13/02
Inventor 曲圆圆孙克明
Owner DALIAN XINE TECH
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