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Low-temperature conductive printed circuit board silver slurry and preparation method thereof

A printed circuit board and silver paste technology, which is applied to circuits, conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, etc., can solve the problems of scrapped conductive lines, shedding of conductive lines, and melting of glass phases. High yield rate of circuit printing, fast melting, and good electrical conductivity

Inactive Publication Date: 2014-08-20
CHIZHOU HUASHUO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.
[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance

Method used

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Examples

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Comparison scheme
Effect test

Embodiment Construction

[0017] A low-temperature conductive printed circuit board silver paste, made of the following raw materials in parts by weight (kg): indium tin oxide 7, 1-10nm flaky silver powder 5, 40-50nm spherical silver powder 5, 1-10μm flaky silver powder 55, E-12 epoxy resin 6, silicone resin 1.6, xylene 14, n-butanol 8, polyurethane resin 1.5, isophorone diamine 0.6, dipentene 1.5, lignin 3, ethylene bisoleamide 0.6, glass powder 13;

[0018] The glass powder is made of the following raw materials in parts by weight (kg): bismuth telluride 16, Si0 2 17. Bi 2 0 3 8. BaO7, Al 2 0 3 4.B 2 o 3 20. V 2 o 5 6. Na 2 O1.5, nano aluminum nitride powder 1.5; the preparation method is: bismuth telluride, Si0 2 、 Bi 2 0 3 , BaO, Al 2 0 3 , B 2 o 3 , V 2 o 5 、Na 2 O mixed, put into a crucible and heated at 1300°C to melt into a liquid, then added nano-aluminum nitride powder, stirred evenly, and then vacuum defoamed, the vacuum degree is 0.13MPa, the defoaming time is 7 minute...

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Abstract

Disclosed is a low-temperature conductive printed circuit board silver slurry. The slurry is prepared by use of the following raw materials in parts by weight: 6-9 parts of indium tin oxide, 4-6 parts of 1-10 nm sheet-like silver powder, 4-6 parts of 40-50 nm spherical silver powder, 50-60 parts of 1-10 [mu]m sheet-like silver powder, 5-7 parts of an E-12 epoxy resin, 1-2 parts of a silicone resin, 12-15 parts of xylene, 7-10 parts of n-butanol, 1-2 parts of a polyurethane resin, 0.4-0.8 parts of isophorone diamine, 1-2 parts of dipentene, 2-4 parts of lignine, 0.4-0.8 parts of ethylene bis oleamide, and 11-14 parts of glass powder. According to the invention, the indium tin oxide is added to the slurry, less silver powder is consumed, the conductivity is good under the condition of a low temperature, and excellent conducting effect is achieved through matching of the silver powder in different particle sizes and different shapes; and the glass powder is low in melting point and small in heat expansion ratio, such that the circuit printing yield is high, and the conducting performance is good.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, in particular to a low-temperature conductive printed circuit board silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide powd...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B13/00
Inventor 胡萍
Owner CHIZHOU HUASHUO ELECTRONICS TECH
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