Low-temperature conductive printed circuit board silver slurry and preparation method thereof
A printed circuit board and silver paste technology, which is applied to circuits, conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, etc., can solve the problems of scrapped conductive lines, shedding of conductive lines, and melting of glass phases. High yield rate of circuit printing, fast melting, and good electrical conductivity
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[0017] A low-temperature conductive printed circuit board silver paste, made of the following raw materials in parts by weight (kg): indium tin oxide 7, 1-10nm flaky silver powder 5, 40-50nm spherical silver powder 5, 1-10μm flaky silver powder 55, E-12 epoxy resin 6, silicone resin 1.6, xylene 14, n-butanol 8, polyurethane resin 1.5, isophorone diamine 0.6, dipentene 1.5, lignin 3, ethylene bisoleamide 0.6, glass powder 13;
[0018] The glass powder is made of the following raw materials in parts by weight (kg): bismuth telluride 16, Si0 2 17. Bi 2 0 3 8. BaO7, Al 2 0 3 4.B 2 o 3 20. V 2 o 5 6. Na 2 O1.5, nano aluminum nitride powder 1.5; the preparation method is: bismuth telluride, Si0 2 、 Bi 2 0 3 , BaO, Al 2 0 3 , B 2 o 3 , V 2 o 5 、Na 2 O mixed, put into a crucible and heated at 1300°C to melt into a liquid, then added nano-aluminum nitride powder, stirred evenly, and then vacuum defoamed, the vacuum degree is 0.13MPa, the defoaming time is 7 minute...
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