Notebook computer structure for conduction and convection heat radiation by using upper cover

Abstract

The invention discloses a notebook computer structure for conduction and convection heat radiation by using an upper cover. The notebook computer structure comprises a cover A with a fin, an air inlet, a nozzle and a rotating shaft, a pair of fans, a heat conducting sheet and a circuit board, wherein the circuit board integrates a memory, a video memory, a CPU (Central Processing Unit), a graphics chip and a South Bridge chip and is jointed on the back surface of a display screen and located in the cover A. According to the notebook computer structure, components which easily dissipate heat in a computer are integrated on one circuit board, the circuit board is moved to the upper cover, the nozzle, the fan and the heat conducting sheet are arranged in the upper cover, the components which easily dissipate heat in the computer are subjected to heat radiation by adopting a principle of an air multiplier so that an internal heat radiation environment and an external heat radiation environment of the notebook computer are changed, and the problem of heat radiation of a high-power computer is effectively solved.

Description

technical field [0001] The invention relates to a notebook computer in the technical field of computers, in particular to a notebook computer structure using an upper cover for conduction and convection heat dissipation. Background technique [0002] The heat dissipation problem of notebook computer has become the inevitable element of computer design, and the notebook computer of prior art is to put memory, display memory, CPU, video card chip and south bridge chip and other easy-to-heat components in the main frame, and the main frame is connected by a rotating shaft. Display, the heat dissipation problem of this structure is more prominent. In use, no matter the computer is placed on the desktop or on the lap, it will cause heat or even heat due to poor heat dissipation on the bottom of the computer. However, with the development and application of high-performance CPUs and chips, the power consumption of computers is increasing, requiring higher fan speeds, and the resul...

AI Technical Summary

Problems solved by technology

[0002] The heat dissipation problem of notebook computer has become the inevitable factor of computer design, and the notebook computer of prior art is to put memory, video memory, CPU, graphics card chip and south bridge chip and other easy-to-heat components in the main frame, and the main frame is connected by a rotating shaft. Display, the heat dissipation problem of this structure is more prominent. In use, no matter the computer is placed on the desktop or on the lap, it will cause heat or even heat due to poor heat dissipation on the bottom of the computer. However, with the development and application of high-performance CPUs and chips, the power consumption of computers is increasing, requiring higher fan speeds, and the resulting noise problems are becoming more and more serious

Images