A method of manufacturing copper wire
A manufacturing method and technology for copper wires, applied in the field of copper wire manufacturing, can solve the problems of high purity of damaged materials, low production efficiency, unfavorable promotion and application of high-purity copper wires, etc., and achieve the effect of avoiding hidden dangers of delamination.
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Embodiment 1
[0057] Example 1: Preparation of a soft high-purity (4N) copper wire with a diameter of 0.1 mm. The raw material is 10 high-purity (4N) electrolytic copper plates, the basic size: thickness 20mm×width 1000mm×length 1200mm.
[0058] see figure 1 , Example 1 Manufacture of high-purity electrolytic copper plate raw materials for manufacturing copper wire, process steps: (1) Sorting high-purity electrolytic copper plate raw materials, sorting out high-purity electrolytic copper plate raw materials without delamination defects and delamination defects.
[0059] In this embodiment, a fully automatic ultrasonic flaw detector is used to inspect 10 high-purity (4N) high-purity electrolytic copper plate raw materials, and it is found that three plates have only delamination defects and no other defects, and the other seven plates have no defects. ⑵. Densify the raw materials of high-purity electrolytic copper sheets with delamination defects to achieve the purpose of treatment without ...
Embodiment 2
[0073] Example 2: Preparation of soft ultra-high-purity (6N) copper wire with a diameter of 0.05 mm.
[0074] The raw material is 10 pieces of high-purity (6N) electrolytic copper plate raw materials, the basic size: thickness 15mm x width 800mm x length 1000mm.
[0075] see figure 2 , embodiment 2 manufactures the method for high-purity copper wire, processing step:
[0076] ⑴. Sorting the ultra-high-purity (6N) electrolytic copper plate raw materials, and sorting out ultra-high-purity electrolytic copper plate raw materials without delamination defects and delamination defects.
[0077]In this embodiment, a full-automatic ultrasonic flaw detector is used to detect high-purity flaws on 10 ultra-high-purity electrolytic copper plate raw materials, and it is found that two plates have only delamination defects and no other defects, and the other eight plates have no defects.
[0078] ⑵. Densify the ultra-high-purity electrolytic copper plate raw materials with delamination d...
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