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A method of manufacturing copper wire

A manufacturing method and technology for copper wires, applied in the field of copper wire manufacturing, can solve the problems of high purity of damaged materials, low production efficiency, unfavorable promotion and application of high-purity copper wires, etc., and achieve the effect of avoiding hidden dangers of delamination.

Active Publication Date: 2016-06-08
王国华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2. Multiple semi-finished copper wires are connected end to end by cold pressure welding, which is not suitable for mass production of high-purity copper wires due to low production efficiency and high production costs.
The average time required for two semi-finished copper wires to be cold-press welded into one line is about 1 to 2 minutes, not including the time for mold replacement, grinding and deburring of each weld, and each semi-finished copper wire is about 5-2 minutes Obviously, this is too low for the production efficiency of copper wires that need to produce several tons or even dozens of tons a day, and the cost of molds consumed when cold-pressing copper wires with larger diameters (above Φ6mm) is also quite high (2000 ~3000 times or so, the mold needs to be replaced), which undoubtedly greatly increases the production cost
[0006] 3. The characteristics of high-purity materials are not considered, and the annealing heat treatment temperature of the wire rod is too high, the energy consumption is high, and it is not conducive to ensuring the high purity of the material
The annealing temperature of the copper wires disclosed in this invention is at least above 300°C (even if the wire is directly heated by energization in this solution, the heating temperature in the high temperature section has actually reached about 550°C), which is actually different from that of conventional pure copper wires. There is no difference in the annealing process of copper. However, such a high annealing temperature will easily cause the oxidation of copper on the one hand, that is, destroy the high purity of the material, and on the other hand cause the problem of high energy consumption in the annealing process.
[0007] The above-mentioned technical defects make the qualified rate of high-purity copper wire products prepared by this method low and the production cost is high, which is not conducive to the promotion and application of high-purity copper wire

Method used

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Examples

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Effect test

Embodiment 1

[0057] Example 1: Preparation of a soft high-purity (4N) copper wire with a diameter of 0.1 mm. The raw material is 10 high-purity (4N) electrolytic copper plates, the basic size: thickness 20mm×width 1000mm×length 1200mm.

[0058] see figure 1 , Example 1 Manufacture of high-purity electrolytic copper plate raw materials for manufacturing copper wire, process steps: (1) Sorting high-purity electrolytic copper plate raw materials, sorting out high-purity electrolytic copper plate raw materials without delamination defects and delamination defects.

[0059] In this embodiment, a fully automatic ultrasonic flaw detector is used to inspect 10 high-purity (4N) high-purity electrolytic copper plate raw materials, and it is found that three plates have only delamination defects and no other defects, and the other seven plates have no defects. ⑵. Densify the raw materials of high-purity electrolytic copper sheets with delamination defects to achieve the purpose of treatment without ...

Embodiment 2

[0073] Example 2: Preparation of soft ultra-high-purity (6N) copper wire with a diameter of 0.05 mm.

[0074] The raw material is 10 pieces of high-purity (6N) electrolytic copper plate raw materials, the basic size: thickness 15mm x width 800mm x length 1000mm.

[0075] see figure 2 , embodiment 2 manufactures the method for high-purity copper wire, processing step:

[0076] ⑴. Sorting the ultra-high-purity (6N) electrolytic copper plate raw materials, and sorting out ultra-high-purity electrolytic copper plate raw materials without delamination defects and delamination defects.

[0077]In this embodiment, a full-automatic ultrasonic flaw detector is used to detect high-purity flaws on 10 ultra-high-purity electrolytic copper plate raw materials, and it is found that two plates have only delamination defects and no other defects, and the other eight plates have no defects.

[0078] ⑵. Densify the ultra-high-purity electrolytic copper plate raw materials with delamination d...

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Abstract

The invention discloses a manufacturing method of a copper wire, and particularly relates to a method for manufacturing a copper wire in which the material purity of the copper wire cannot be changed during the manufacturing process of the copper wire. According to the technical scheme, the manufacturing method comprises the steps that copper plate raw materials are sorted, texture densification treatment is carried out on the copper plate raw materials with layering defects, the copper plate raw materials are cut to obtain copper bars with designed widths, irregular rule round processing is carried out on the copper bars to prepare copper rods with round cross sections, surface treatment is carried out on the copper rods, then continuous extrusion is carried out to prepare coiled round copper wires, drawing forming and annealing heat treatment during the drawing process are repeatedly and circularly carried out on the coiled round copper wires according to the designed diameter of the copper wires and the deformation rate of once drawing forming so as to obtain the copper wire product. The copper wire preparation method is high in production efficiency, low in energy consumption and simple in technology, is free of impurities during the manufacturing process and is particularly suitable for manufacturing of high-purity copper wires by high-purity electrolysis copper plates, and the manufactured copper wire has the advantages of high purity, high conductivity, good processing performance and the like.

Description

technical field [0001] The invention relates to a copper wire manufacturing method, in particular to a copper wire manufacturing method which utilizes electrolytic copper plate raw materials and does not change the purity of the copper wire during the manufacturing process. Background technique [0002] High-purity copper in a narrow sense (the purity of copper reaches more than 99.99%, or 4N copper) and ultra-high-purity copper (5N-7N) can be called high-purity copper in a broad sense, and the high-purity copper wire made on the basis of it is used as High-end electronic materials have very broad application prospects in electronic and electrical products, such as: high-definition TV signal lines, high-quality speaker wires, enameled wires for electric vehicle motors, targets for vacuum evaporation, robot transmission cables, and copper for solar photovoltaics. In specific applications such as belts, a large amount of high-purity copper wire is used as the core material of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21C37/04H01B13/00
Inventor 徐卓辉王国华
Owner 王国华
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