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Method for preparing high-thermal conductivity polyimide/magnesium oxide composite film

The technology of polyimide and composite film is applied in the field of preparation of high thermal conductivity polyimide/magnesium oxide composite film, and can solve the problems of difficulty in realizing large-scale production, poor reliability and durability, and high equipment requirements. Achieve the effect of enhanced bonding, low cost, and improved security

Inactive Publication Date: 2014-07-16
LAIWU ZHONGTIAN INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Ordinary polyimide thick film has good insulation properties, but its thermal conductivity is poor, about 0.18W m -1 k -1 , the existing defect is that it is easy to cause circuit heating, difficult to dissipate, circuit temperature rise and other undesirable phenomena during the high-density operation and high-speed process of electronic components, and the reliability and durability of the use are poor. Thermal conductivity is of great significance to its application and life
[0004] The existing technology mainly adopts the following methods to improve the thermal conductivity of polymers: First, based on the theory of particle thermal conductivity, a polymer with a high degree of orientation is synthesized through a parallel high-magnification stretching process. The problem with this method is that the equipment requirements Higher, and when the tensile strength reaches a certain value, the film will break; the second is to use polymers with excellent thermal conductivity such as polyacetylene and polypyrrole as doping agents to prepare composite materials with high thermal conductivity. Crystalline highly oriented polymers are difficult to prepare, and it is difficult to achieve large-scale production; the third is to use the inorganic filler doping method, that is, doping alumina, aluminum nitride, boron nitride, graphite and other fillers with high thermal conductivity into the polymer In polymers, composite materials with improved thermal conductivity are obtained. This method has low cost of inorganic fillers and is easy to process and shape. It can be applied to some special fields after proper treatment, but magnesium oxide has not been used in the prior art. Doping technology as a filler

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Add 1000ml DMAc solution in the synthesis reactor, 80.096g4,4'-diaminodiphenyl ether (ODA) is added wherein, stir to make it dissolve completely, then add the PMDA reagent of same molar amount wherein, add 5.0203g via The surface-treated nano-thermal conductive material MgO, the selected MgO particle size is 10nm, 200nm, 1500nm respectively, and the mixing volume ratio of the three is 1:2:3. After using a high-speed shear disperser to fully mix the system; control the mixed system to react at 45°C for about 7 hours, and synthesize polyamic acid resin (PAA) doped with nano-thermal conductive materials.

[0030] After the defoaming treatment, the obtained PAA resin was cast on a stainless steel belt, dried at 120°C for 1 hour to form a film, and then baked at 140°C, 180°C, 220°C, 260°C, and 380°C for 1 hour, and then It was placed in an environment of 350°C for imidization treatment, and a polyimide / magnesia composite film (PI / MgO) with high thermal conductivity was prepa...

Embodiment 2

[0033] Add 1000ml NMP solution to the synthesis reactor, add 80.096g ODA to it, stir to make it completely dissolved, then add the same molar amount of PMDA reagent to it, and add 10.0407g of surface-treated nano-thermal conductive material MgO at the same time, the selected MgO particles The diameters are 10nm, 200nm, and 1500nm, respectively, and the mixing volume ratio of the three is 1:2:4. After using a high-speed shear disperser to fully mix the system; control the mixed system to react at 50°C for about 8 hours, and synthesize polyamic acid resin (PAA) doped with nano-thermal conductive materials.

[0034] After the defoaming treatment, the obtained PAA resin was cast on a stainless steel belt, dried at 130°C for 1 hour to form a film, and then baked at 140°C, 180°C, 220°C, 260°C, and 380°C for 1 hour, and then It was placed in a 400°C environment for imidization treatment to prepare a polyimide / magnesia composite film (PI / MgO) with high thermal conductivity. During th...

Embodiment 3

[0037] Add 1000ml DMF solution to the synthesis reactor, add 80.096g ODA therein, stir to make it dissolve completely, then add the same molar amount of PMDA reagent to it, and add 15.061g of nano thermal conductive material MgO through surface treatment at the same time, the selected MgO particles The diameters are 10nm, 200nm, and 1500nm respectively, and the mixing ratio of the three is 1:2:4.5. After using a high-speed shear disperser to fully mix the system; control the mixed system to react at 55°C for about 9 hours, and synthesize polyamic acid resin (PAA) doped with nano-thermal conductive materials.

[0038]After defoaming treatment, the obtained PAA resin was cast on a stainless steel belt, dried at 140°C for 1 hour to form a film, and then baked at 140°C, 180°C, 220°C, 260°C, and 380°C for 1 hour, and then It was placed in a 400°C environment for imidization treatment to prepare a polyimide / magnesia composite film (PI / MgO) with high thermal conductivity. During the...

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PUM

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Abstract

The invention discloses a method for preparing a high-thermal conductivity polyimide / magnesium oxide composite film. The method comprises following steps of (1) dissolving monomer diamine into an organic solvent, stirring to dissolve so as to form a mixed solution; (2) adding monomer dianhydride of the same molar ratio into the solution of step (1), adding a nanometer heat conduction material, mixing uniformly; (3) synthesizing the mixed system of step (2) into nanometer heat conduction material doped polyamide acid resin under conditions that the temperature is 45-55DEG C and reaction time is 7-12 hours; (4) tape casting the polyamide acid resin of step (3) on a stainless steel band, drying to form a cast film, carrying out imidization on the cast film at 350-460DEG C, so as to prepare the polyimide / magnesium oxide composite film. The magnesium oxide inorganic filler is treated on the surface, so as to form effective bonding at the interface, so that thermal contact resistance is reduced, the heat conducting property of the magnesium oxide inorganic filler is improved, and the heat conducting property of the composite material is improved.

Description

technical field [0001] The invention relates to the technical field of polymer insulating packaging materials, in particular to a method for preparing a high thermal conductivity polyimide / magnesium oxide composite film used in industries such as printed circuit boards, microelectronics, and high-temperature-resistant flexible printed circuit substrates . Background technique [0002] Insulating materials are widely used in electronic components, integrated circuits and other fields. With the advancement of science and technology, the electronic integration industry is advancing by leaps and bounds, and related electronic products are increasingly becoming thinner and smaller, which makes their operating frequency increase sharply. To operate stably in the environment and to dissipate excess heat in time, a heat-conducting insulating material with high heat dissipation performance, reliable operation, and good comprehensive performance is required, so that it can not only pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08K9/06C08K3/22C08G73/10
Inventor 祝春才王文晓
Owner LAIWU ZHONGTIAN INSULATING MATERIAL
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