Production process of 6-inch lithium niobate or lithium tantalite chips
A production process, lithium niobate technology, applied in the direction of manufacturing tools, metal processing equipment, surface polishing machine tools, etc., can solve the problems of easy cracking and increased difficulty of wafer processing, so as to improve utilization rate, increase production efficiency, The effect of reducing static charge discharge
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Embodiment 1
[0020] A kind of production technology of 6 inches lithium niobate wafer or lithium tantalate wafer, its step is as follows:
[0021] A: The 6-inch lithium niobate and lithium tantalate crystals are cut into wafers with a thickness of 0.8mm by wire, and then poured into a C-shaped edge with an automatic chamfering machine, and put into the corrosion solution for 10 hours to reduce the internal stress;
[0022] B: Put the wafer into the reduction furnace. The wafer and the wafer are heated to 500--600° with nitrogen gas through the company's special reduction paper, and then cooled to room temperature to take out the reduced black or brown lithium niobate lithium tantalate wafer;
[0023] C: Grind with 16B double-sided grinder and No. 1000 green carbon silica sand, the equipment speed is 15 rpm, the reverse pressure is 100MPa, grind to a thickness of 0.53mm according to the reading of the grating ruler, take out the wafer, and clean it with ultrasonic waves. Then put it into th...
Embodiment 2
[0030] A kind of production technology of 6 inches lithium niobate wafer or lithium tantalate wafer, its step is as follows:
[0031] A: The 6-inch lithium niobate and lithium tantalate crystals are cut into wafers with a thickness of 0.6mm by wire, and then poured into a C-shaped edge with an automatic chamfering machine, and put into the corrosion solution for 8 hours to reduce internal stress;
[0032] B: Put the wafer into the reduction furnace. The wafer and the wafer are heated to 500--600° with nitrogen gas through the company's special reduction paper, and then cooled to room temperature to take out the reduced black or brown lithium niobate lithium tantalate wafer;
[0033] C: Grind with 16B double-sided grinder and No. 1000 green carbon silica sand, the equipment speed is 15 rpm, the reverse pressure is 100MPa, grind to a thickness of 0.55mm according to the reading of the grating ruler, take out the wafer, and clean it with ultrasonic waves. Then put it into the cor...
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