Plugging material with high thermal conductivity and preparation method of plugging material

A high thermal conductivity, plugging technology, applied in the field of electronic materials, to achieve good thermal conductivity, solve local overheating, high thermal conductivity

Active Publication Date: 2014-06-25
AKM ELECTRONICS INDAL PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the printed circuit board industry, especially in the field of high-power device packaging, although some progress has been made in the research and development and application of plug hole materials, there are still areas to be improved in terms of thermal conductivity and temperature resistance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A plug hole material, prepared according to the following steps:

[0027] 1) Add the resin diluent isophorone into the plugging resin (specifically, one-component thermosetting epoxy resin), and stir thoroughly for 30 minutes to reduce the viscosity of the plugging resin, among which the plugging resin and resin The mass ratio of diluent is 1:0.02;

[0028] 2) According to the mass ratio of plugging resin and silver-coated copper powder of 1:1.5, weigh the silver-coated copper powder with a particle size of 1-5μm and a silver content of 5-10wt%, and add plasticizer to the silver-coated copper powder Agent dibutyl phthalate and dispersant D-3021 (Rohm and Haas Company), wherein the amount of plasticizer and dispersant are 0.02% and 0.05% of the mass of silver-coated copper powder respectively;

[0029] 3) Transfer the plugging resin diluted in step 1) and the silver-coated copper powder mixed with plasticizer and dispersant in step 2) into a ball mill tank, and add 0.08...

Embodiment 2

[0033] A plug hole material, prepared according to the following steps:

[0034] 1) Add the resin diluent isophorone into the plugging resin (specifically, one-component thermosetting epoxy resin), and stir thoroughly for more than 30 minutes to reduce the viscosity of the plugging resin. The plugging resin and The mass ratio of resin diluent is 1:0.05;

[0035] 2) According to the mass ratio of plugging resin and silver-coated copper powder of 1:2, weigh the silver-coated copper powder with a particle size of 1-5μm and a silver content of 5-10wt%, and add plasticizer to the silver-coated copper powder Agent dibutyl phthalate and dispersant D-3021 (Rohm and Haas Company), wherein the amount of plasticizer and dispersant are 0.05% and 0.08% of the mass of silver-coated copper powder respectively;

[0036] 3) Transfer the plugging resin diluted in step 1) and the silver-coated copper powder mixed with plasticizer and dispersant in step 2) into a ball mill tank, and add 0.1% of ...

Embodiment 3

[0040] A plug hole material, prepared according to the following steps:

[0041] 1) Add the resin diluent isophorone into the plugging resin (specifically, one-component thermosetting epoxy resin), and stir thoroughly for more than 50 minutes to reduce the viscosity of the plugging resin, among which the plugging resin and The mass ratio of resin diluent is 1:0.04;

[0042] 2) According to the mass ratio of plugging resin and silver-coated copper powder of 1:1.7, weigh the silver-coated copper powder with a particle size of 1-5μm and a silver content of 5-10wt%, and add plasticizer to the silver-coated copper powder Agent dibutyl phthalate and dispersant D-3021 (Rohm and Haas Company), wherein, the amount of plasticizer and dispersant are respectively 0.04% and 0.07% of the mass of silver-coated copper powder;

[0043] 3) Transfer the plugging resin diluted in step 1) and the silver-coated copper powder mixed with plasticizer and dispersant in step 2) into a ball mill tank, a...

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PUM

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Abstract

The invention provides a plugging material with high thermal conductivity and a preparation method of the plugging material. The formula of the plugging material contains plugging resin and silver coated copper powder, wherein the mass ratio of the plugging resin to the silver coated copper powder is 1: (1.5-2). The plugging material provided by the invention has the characteristics of high thermal conductivity and good stability.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a high thermal conductivity plug hole material and a preparation method thereof. Background technique [0002] With the continuous development of electronic products, especially the high integration of semiconductor chips and the rapid increase in the number of I / O (input / output), and the rapid development of high-density mounting technology, it is urgently required that the mounting substrate - printed circuit board (PCB) become Electronic components that can greatly increase assembly density with high density, high precision, high reliability and low cost requirements. This also reflects the high requirements for the plugging process and plugging material of the printed circuit board. The Chinese patent application with the publication number CN103387736 discloses an epoxy resin composite material, which has a good dielectric constant and good flexibil...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/10C08K3/08C08K5/12C08K5/07
Inventor 王靖崔成强
Owner AKM ELECTRONICS INDAL PANYU
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