Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

resin composition

A technology of resin composition and compound, which is applied in the direction of circuits, electric solid devices, semiconductor devices, etc., can solve the problem that the copper corrosion of the electrode part cannot be prevented, and achieve the effect of excellent preservation characteristics

Active Publication Date: 2019-03-15
NAMICS CORPORATION
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, although benzotriazoles have the effect of preventing migration, they cannot prevent copper corrosion of the electrode part.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • resin composition
  • resin composition
  • resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~20、 comparative example 1、2

[0079] The resin composition was prepared according to the proportion shown in Table 1 and Table 2. All the prepared resin compositions are in liquid state. (C) As a component, α-tocopherol, β-tocopherol or α-tocotrienol manufactured by Wako Pure Chemical Industries, Ltd. was used. In addition, in Examples 1-20 and Comparative Examples 1 and 2, the acid anhydride equivalent, amine equivalent or phenol equivalent of (B) component were all 0.8 with respect to 1 epoxy resin equivalent of (A) component.

[0080] [Viscosity evaluation]

[0081] The viscosity (initial viscosity, unit: mPa·s) of the resin composition just produced was measured with the Toki Sangyo Co., Ltd. E-type viscometer (model: TVE-22H). Table 3 and Table 4 show the measurement results of the initial viscosity (denoted as viscosity in the table). In addition, the viscosity of the resin composition after storage at 25°C and 50% relative humidity for 24 hours or 48 hours was measured, and (viscosity after 24 or...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The present invention addresses the problem of preventing migration in a resin composition after curing and the problem of suppressing a curing reaction during storage of the resin composition, specifically the problem of suppressing thickening of the resin composition during storage in cases where the resin composition is to be used in a liquid state. Consequently, the purpose of the present invention is to provide a highly reliable resin composition which has excellent storage characteristics and excellent migration resistance after curing. This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent and (C) at least one compound selected from the group consisting of compounds such as tocols and tocotrienols having specific structures.

Description

technical field [0001] The present invention relates to a resin composition, and in particular, to a resin composition suitable for encapsulation of a flip chip type (flip chip) semiconductor element. Background technique [0002] Generally, a semiconductor device includes a substrate and a semiconductor element mounted on the substrate, and the semiconductor element and the substrate are electrically connected by bumps or bonding wires, and then packaged with a resin composition. to manufacture. [0003] In recent years, in order to meet the demands for higher density and higher output of semiconductor devices such as liquid crystal driver ICs, fine pitches of wiring patterns of substrates on which semiconductor devices are mounted have been developed. Migration between wiring patterns is a concern due to the increase in pitch and the increase in voltage accompanying the increase in output. Migration is a phenomenon in which the metal of the wiring pattern is eluted by an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/40C08K5/1545C08L63/00H01L23/29H01L23/31
CPCH01L23/293C08G59/4007C08G59/4284C08K5/1545H01L21/563H01L2224/92125C08L63/00
Inventor 增子努柳沼宗宪明道大树本间洋希
Owner NAMICS CORPORATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products