High-heat-conductivity-coefficient radiating patch

Abstract

The invention discloses a high-heat-conductivity-coefficient radiating patch. The high-heat-conductivity-coefficient radiating patch is characterized in that a graphite layer is obtained by a following process method including the following steps: respectively coating a layer of graphite modifying agent on the upper and lower surfaces of a polyimide membrane so as to obtain the processed polyimide membrane, wherein the graphite modifying agent comprises the following components in parts by weight: 30-35 parts of benzenetetracarboxylic anhydride, 10-15 parts of benzophenone tetracarboxylic dianhydride, 22-26 parts of diaminodiphenylmethane, 20-25 parts of dimethylformamide, 8-10 parts of N-methyl pyrrolidone, 1.8-2.5 parts of ethylene glycol, 2.5-3 parts of polydimethylsiloxane and 0.8-1.5 parts of dibutyl phthalate; heating the processed polyimide membrane to be 790-810 DEG C, and heating the polyimide membrane to 1180-1250 DEG C so as to obtain a pre-fired carbonization membrane; calendering the pre-fired carbonization membrane by virtue of a calendar; heating the pre-fired carbonization membrane to 2850-2950 DEG C so as to obtain a mainly-fired graphite membrane. According to the high-heat-conductivity-coefficient radiating patch, the stability and reliability of the radiating performance of a product are improved when the uniformity of the heat-conducting performance is realized, and the cost of the product is greatly lowered.

Description

technical field [0001] The invention relates to a heat dissipation patch with high thermal conductivity, belonging to the technical field of heat dissipation patches. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

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