Production method of high-density radiating fins

Abstract

The invention provides a production method of high-density radiating fins. The production method comprises the following steps: applying a graphite modifier to an upper surface and a lower surface ofa polyimide film, wherein the treated polyimide film is composed of a polyimide film, a first coating layer and a second coating layer, and the graphite modifier comprises the following components inparts by weight: benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, diaminodiphenylmethane, dimethylformamide, N-methylpyrrolidone, ethylene glycol, polydimethylsiloxane and dibutyl phthalate; heating up the treated polyimide film from a room temperature to 1200 DEG C to obtain a pre-fired carbonized film; heating up the carbonized film to 2850-2950 DEG C, and then cooling to obtain a primarily fired graphite film. The production method provided by the invention realizes uniformity of thermal conductivity and also improves heat dissipation performance of products.

Description

technical field [0001] The invention relates to a production method of a high-density heat sink, belonging to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness