High-compactness and heat dissipating double-sided adhesion film

Abstract

The present invention discloses a high-compactness and heat dissipating double-sided adhesion film, wherein a release material layer is adhered on a heat conduction adhesion layer surface opposite to a graphite layer, and the graphite layer preparation method comprises: uniformly coating the upper surface and the lower surface of a polyimide film with a layer of a graphite modifier to obtain a treated polyimide film, wherein the viscosity of the graphite modifier is 30000-48000 CP; heating the treated polyimide film to a temperature of 1180-1250 DEG C from a room temperature, and cooling to obtain a pre-fired carbonized film; calendering the pre-fired carbonized film with a calendering machine; heating to a temperature of 2850-2950 DEG C to obtain a mainly-fired graphite film; and calendering the obtained mainly-fired graphite film to obtain the graphite layer. According to the present invention, the volume shrinkage during the wrinkling and graphitization sintering process is avoided, the compactness and the crystallinity are increased, and the heat conduction performances in the vertical direction and the horizontal direction are further improved.

Description

technical field [0001] The invention relates to a double-sided film for high-density heat dissipation, which belongs to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickl...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness