Manufacturing process of heat-dissipating fin

Abstract

The invention discloses a manufacturing process of a heat-dissipating fin. The manufacturing process comprises the following steps of: separately coating a graphite modifier on the upper and lower surfaces of a polyimide film, wherein the treated polyimide film is composed of a polyimide film, a first coating and a second coating, and the graphite modifier is composed of the following components: benzophenonetetracarboxylic dianhydride, benzenetetracarboxylic anhydride, diaminodiphenylmethane, dimethylformamide, N-methyl pyrrolidinone, ethylene glycol, polydimethylsiloxane and dibutyl phthalate; heating the treated polyimide film from room temperature to 1200 DEG C to obtain a pre-sintered carbonized film; and heating the carbonized film to 2850-2950 DEG C and cooling the film to obtain the sintered graphite film. The stability and reliability of the heat-dissipating property of a product are improved while the uniformity of the heat-conducting property is realized.

Description

technical field [0001] The invention relates to a manufacturing process of a heat sink, belonging to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer heat to ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness