Substrate roasting device and temperature adjustment method thereof
A baking device and temperature adjustment technology, which is applied to optics, instruments, electrical components, etc., can solve problems such as differences in residual film rate, and achieve the effect of improving film thickness uniformity and good film thickness uniformity
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[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0031] Such as image 3 A specific example of the substrate baking apparatus of the present invention is shown. In this embodiment, the substrate baking device of the present invention includes a temperature adjustment mechanism 10 and a baking equipment body 6 for baking the substrate.
[0032] Such as figure 1 Shown is a specific structure of the baking equipment body 6 . The baking equipment body 6 includes:
[0033] The thermal plate 2 (as figure 2 As shown), each partition hot plate 2.1 includes a plate body and a heating member 1 arranged under the plate body; generally, the heating member 1 adopts resistance wire or heating wire, and the heating temperature of the resistance wire or heating wire is adjusted by the temperature adjustment mechanism 10 ;
[0034] The heat conduction layer 3 is arranged on the heat plate 2, and the he...
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