Production method of LED (light emitting diode) chip

Abstract

The invention discloses a production method of an LED (light emitting diode) chip. The production method comprises the following steps of providing a substrate, and sequentially producing an N-type semiconductor layer, a luminescent layer and a P-type semiconductor layer on the substrate to form an LED wafer; depositing an ITO (indium oxide) transparent conductive layer on the LED wafer; performing the MESA photoetching on the ITO transparent conductive layer through photoetching glue to form an MESA layer; performing ITO etching on the ITO transparent conductive layer; performing the ICP etching on the LED wafer to form an N-type semiconductor table-board; removing the photoetching glue remained after the MESA photoetching; depositing a passivation layer on the ITO transparent conductive layer and the N-type semiconductor table-board; performing the PAD photoetching on the passivation layer through the photoetching glue to form a PAD layer; performing the passivation etching on the PAD layer, and removing the passivation layer in the area of the PAD layer; producing a P electrode and an N electrode on the etched passivation layer; and removing the photoetching glue remained after the PAD photoetching. By adopting the method, a self-aligning function of the photoetching can be realized, the machining flow of the chip can be shortened, and the machining cost of the chip can be reduced, the ITO light emitting area is increased, and the brightness of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor light emitting devices, in particular to a method for manufacturing an LED chip. Background technique [0002] A light-emitting diode (Light-Emitting Diode, LED) is a semiconductor electronic component that can emit light. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the luminosity has also increased to a considerable extent. of luminosity. And the use is also used as indicator lights, display panels, etc. from the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in displays, TV lighting decoration and lighting. [0003] Existing LED chip manufacturing methods usually include five, four or three photoli...

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Problems solved by technology

[0019] In the prior art, the manufacturing process of LED chips is complicated, and the number of lithography passes is large, and the process repeatedly passes through the same station (such as coating, photolithography, development, deglue, etc.), which is prone to errors; and there will be gaps between photolithography steps. Alignment accuracy problems, many processes lead to high product costs; a safe area of ​​about 4-5um needs to be reserved between ITO and MESA, resulting in a smaller effective area of ​​ITO and lower brightness

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