Intelligent power module and manufacturing method thereof

Abstract

The invention belongs to the technical field of electronic devices and provides an intelligent power module and a manufacturing method thereof. The intelligent power module comprises a metal substrate, an insulating layer covering one surface of the metal substrate, a circuit wiring layer formed on the insulating layer, circuit elements which are configured at preset positions on the circuit wiring layer, and pins connected with the circuit wiring layer. The intelligent power module urther comprises a recessed hole which penetrates the insulating layer and extends to the metal substrate; the circuit wiring layer is connected with the bottom of the recessed hole through a metal wire; the recessed hole is filled with a cured conductive material; a tail portion of the metal wire, which is connected with the bottom of the recessed hole, is buried in the conductive material; and at least one surface of the metal substrate, which is provided with the circuit elements, is sealed. According to the intelligent power module of the invention, the recessed hole is filled with the conductive material, such that the connection of the metal wire and the bottom of the recessed hole can be realized by means of a bonding force of the metal wire and the recessed hole, and can be enhanced through the adhesive force of the conductive material, and therefore, reliable connection of the meal wire and the metal substrate can be realized, and the miniaturization of the module can be facilitated, and processing difficulty can be controlled, and cost can be decreased.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and in particular relates to an intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with traditional discrete solutions, IPM has won an increasing market with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies for driving motors. An ideal power electronic device for electric tra...

AI Technical Summary

Problems solved by technology

However, this method increases the flattening equipment, and has high requirements for the force of flattening, the speed of contact, and the accuracy of the flattened position. The design of this kind of equipment is difficult, the manufacturing cost is high, and the operation requirements for the operator It is also relatively high. Using this method to flatten the bottom will undoubtedly increase the manufacturing cost, manufacturing difficulty and pass rate of IPM.

Moreover, this method still uses the bonding force between the metal wire 108 and the metal substrate 101 to achieve fixation, and there is still a risk of wire breakage for long-term use under relatively harsh working conditions.

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