Method for manufacturing packaging product with metalized side wall

Abstract

The embodiment of the invention discloses a method for manufacturing a packaging product with the metalized side wall. Metallization is conducted on the side wall after packaging is conducted, metallization can be conducted on the side wall without forming a groove in the process of manufacturing a substrate, and therefore manufacturing of the substrate is simplified. When the packaging process is conducted, due to the fact that the groove has not been formed in the substrate for metallization of the side wall, no special jig is needed when processing is conducted through the vacuum absorption technology, and therefore positioning is very easy to conduct, the packaging process is simplified, the process complexity of the packaging product with the metalized side wall is lowered, production cost is reduced, and work efficiency is improved. When the packaging process is conducted, the groove has not been formed in the substrate, the strength of the substrate is ensured, the problem of substrate cracking caused by improper force exertion can not occur, and therefore the product quality is ensured. In addition, due to the fact that the accuracy of groove forming in the packaging process is higher than the accuracy of groove forming in the substrate manufacturing process, the number of packaging substrate units which can be arranged on a strip is increased. In addition, machining of multi-electrode packaging products with the metalized side walls can be achieved through the method.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for manufacturing sidewall metallized packaging products. Background technique [0002] In the printed circuit board (Printed Circuit Board, PCB) or substrate (Substrate) manufacturing process, side wall metallization is to plate metal on the side of the package substrate unit, so as to realize the interconnection and conduction of the circuit on the front and back of the package substrate unit , and ensure good electrical performance and subsequent surface mount technology (Surface Mounted Technology, SMT) soldering reliability. Such as figure 1 As shown, a plurality of identical package arrays are usually arranged on a strip, and each package array is arranged with the same package substrate unit and electronic components arranged on each package substrate unit. There are grooves 101, and the strip will not be cut until the substrate of the entire strip is manuf...

AI Technical Summary

Problems solved by technology

Since the existing technology has carried out side wall metallization on the substrate before packaging, on the one hand, when performing packaging processes such as chip placement, wire bonding, package plastic sealing, and marking, vacuum adsorption technology is required, and When the substrate is metallized on the side wall, the slotted area is dense, which makes the shape of the substrate complex, so that special jigs need to be used to avoid the slotted area during the packaging process, and when using special jigs for vacuum adsorption, positioning Difficult, the process complexity is high and the work efficiency is low, and the use of special fixtures also increases the cost of production tools; , it is easy to cause the substrate to crack somewhere due to improper force application, thereby increasing the risk of product quality, especially for the case of thinner substrates and smaller-sized packaging substrate units, this problem is particularly prominent, and due to the groove It needs to occupy a large space, so that the number of packaging substrate units that can be laid out on a strip of a certain area is reduced

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