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Micro relay contacts, reed gold plating process

A technology of micro relay and process method, applied in the field of gold plating process, reed gold plating process, and micro relay contacts, can solve the problems of unstable static bonding of contact resistance of TO-5 micro relay in gold plating process, and achieve good quality consistency , The effect of improving the consistency of coating quality and reducing the bonding failure rate

Active Publication Date: 2016-08-24
贵州振华群英电器有限公司(国营第八九一厂)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to: a micro relay contact, reed gold plating process, to solve the existing gold plating process can not well solve the functional problems of TO-5 micro relay contact resistance instability and static bonding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1 of the present utility model: a kind of micro-relay contact, reed gold-plating process, in its material and composition thereof: the gold trichloride of 6-14g / L with gold content; Anhydrous sodium nitrite 100 -200g / L; Potassium citrate 30-100g / L; Potassium chloride 30-90g / L; EDTA 5-15g / L; Cobalt sulfate heptahydrate 0.5-5g / L; Silver nitrate 0.01-0.3g Put the electroplating workpiece into the electroplating solution of / L for the following process: degreasing → cleaning → polishing → cleaning → HF acid immersion cleaning → cleaning → cleaning → activation → cleaning → cleaning → electroplating → recycling → cleaning → cleaning → dehydration → Dry; during electroplating, the positive and negative on-off time ratio is 2:8, and the positive and negative conduction times are 100ms and 10ms respectively; that is to say, in the 100ms of forward electroplating, 20ms is electroplating, and 80ms is disconnected; the same reverse During the 10ms of stripping the gold-...

Embodiment 2

[0017] Embodiment 2 of the present invention: micro-relay contacts, reed gold plating process, preferred scheme is: its material and composition thereof are: gold trichloride of 8.5-10.5g / L in terms of gold content; Sodium nitrate 150-180g / L; Potassium citrate 60-80g / L; Potassium chloride 50-70g / L; EDTA 10-15g / L; Cobalt sulfate heptahydrate 1-2g / L; Silver nitrate 0.05 -0.1g / L electroplating solution put the electroplating workpiece into the following process: degreasing→cleaning→finishing→cleaning→HF acid immersion cleaning→cleaning→cleaning→activation→cleaning→cleaning→electroplating→recycling→cleaning→cleaning →Dehydration→Drying; during electroplating, the positive and negative on-off time ratio is 2:8, and the positive and negative on-off time are 100ms and 10ms respectively; the pH value of the electroplating solution is between 9-11; the temperature of the electroplating solution is 45-50 ℃. Using this preferred solution, the stability of the electrolyte is stronger; th...

Embodiment 3

[0018] Embodiment 3 of the present invention: miniature relay contact, reed gold-plating process, its material and composition thereof are: the gold trichloride of 9g / L in terms of gold content; Anhydrous sodium nitrite 165g / L; Citric acid Potassium 70g / L; Potassium chloride 60g / L; EDTA 13g / L; Cobalt sulfate heptahydrate 1.5g / L; Silver nitrate 0.08g / L electroplating solution is put into electroplating workpiece and carries out following procedure processing: Oil→cleaning→finishing→cleaning→HF acid immersion cleaning→cleaning→cleaning→activation→cleaning→cleaning→electroplating→recycling→cleaning→cleaning→dehydration→drying; during electroplating, the positive and negative on-off time ratio is 2:8, The positive and negative conduction times are 100ms and 10ms respectively; the pH value of the electroplating solution is between 9-11; the temperature of the electroplating solution is 45-50°C. Using this preferred solution, compared with Example 2, the stability of the electrolyte...

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Abstract

The invention discloses a gold-plating process method for contacts and reeds of miniature relays. The materials and the composition thereof are: gold trichloride of 6-14g / L in terms of gold content; anhydrous sodium nitrite 100-200g / L ; Potassium citrate 30-100g / L; Potassium chloride 30-90g / L; EDTA 5-15g / L; Cobalt sulfate heptahydrate 0.5-5g / L; The electroplating of silver nitrate 0.01-0.3g / L Put the electroplating workpiece into the solution for electroplating. Compared with the prior art, in terms of structural features of the present invention, the density is higher than that of the original cyanide gold-plated cobalt alloy gold plating, the purity of the gold coating reaches 99.99%, and the hardness is (110-120) HV, which is higher than the original cyanide gold-plated cobalt alloy gold plating The hardness of the gold layer (85-100) HV is high, which is lower than that of the original cyanide gold-plated nickel alloy (180-220) HV; in terms of technical improvement, the stability of the electrolyte and the dispersion ability are greatly improved, and the compactness of the coating layer is improved; quality; In terms of improvement, the contact resistance failure rate of its products decreased by 95%, the bonding failure rate decreased by 70%, and the consistency of coating quality increased by 80%.

Description

technical field [0001] The invention relates to a gold-plating process method for micro-relay contacts and reeds, and belongs to the technical field of gold-plating process methods. Background technique [0002] Most of the previous gold-plating processes for relay contacts use cyanide as a complexing agent, but because the cyanide has a relatively strong complexing ability, the accumulated impurities are not easy to eliminate if used for a long time, and the coating has a high porosity, and the coating tends to contain copper impurities. . With the development of our company's TO-5 miniature electromagnetic relay products and the mass production of other weak power relays, we found that there will be unstable contact resistance and static bonding problems, which requires us to study a new electroplating gold plating process for Solve problems that arise. If cyanide complex gold-plated cobalt alloy and gold-nickel alloy are used, the hardness is improved, but the contact r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/48
Inventor 王思醇赵瑞平罗毅陈燕
Owner 贵州振华群英电器有限公司(国营第八九一厂)
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