Biosensor based on vertical-structure tunneling field effect transistor and preparation method thereof
A technology of tunneling field effect and biosensor, applied in the field of biosensor and its preparation based on vertical structure tunneling field effect transistor, can solve the problem of insensitivity to the change of channel surface charge, and achieve the goal of channel surface charge Sensitive to changes, steep subthreshold slope, and improved work performance
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[0058]The invention provides a method for preparing a biosensor based on a vertical structure tunneling field effect transistor, such as figure 1 Shown is a schematic flow chart, and the preparation method of the biosensor at least includes the following steps:
[0059] S1, preparing a tunneling field effect transistor with a vertical structure as a converter, the channel in the tunneling field effect transistor is suspended, and the channel forms a vertical structure with the source and the drain;
[0060] S2, performing surface activation modification on the surface of the channel by using a surface modifier.
[0061] The fabrication method of the vertical structure tunneling field effect transistor of the present invention will be described in detail below with reference to the specific drawings.
[0062] First, step S1 is performed to prepare a tunneling field effect transistor with a vertical structure as a converter, the channel in the tunneling field effect transistor ...
Embodiment 2
[0089] The present invention also provides a biosensor based on a vertical structure tunneling field effect transistor, which is made by using the preparation method provided in Example 1. The biosensor based on a vertical structure tunneling field effect transistor at least includes:
[0090] The converter is a tunneling field effect transistor with a vertical structure; the channel in the tunneling field effect transistor is suspended, and the channel forms a vertical structure with the source and the drain;
[0091] The surface modifier covers the surface of the channel.
[0092] Preferably, the tunneling field effect transistor of the vertical structure at least includes:
[0093] The SGOI substrate 1 includes a buried oxide layer 11 and P-type heavily doped SiGe12 located on both sides of the buried oxide layer 11, wherein the P-type heavily doped SiGe12 on one side is defined as a source 121;
[0094] A channel 21 with a nanowire or nanorod structure suspended over the ...
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