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Heat-dissipating aluminum-based circuit board

A technology for circuit boards and aluminum substrates, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve problems such as the inability to meet the development requirements of high-power LEDs, and achieve the effects of simple structure, high insulation breakdown voltage, and high thermal conductivity

Inactive Publication Date: 2014-01-29
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, traditional FR-4 aluminum-based circuit boards or T-preg aluminum-based circuit boards can no longer meet the current development requirements of high-power LEDs in the electronics industry.

Method used

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  • Heat-dissipating aluminum-based circuit board
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  • Heat-dissipating aluminum-based circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0021] Embodiment: A heat-dissipating aluminum-based circuit board, which is formed by pressing a double-sided copper foil substrate 41, a dielectric layer 43 and an aluminum substrate 42, and the dielectric layer 43 is located between the double-sided copper foil substrate 41 and the Between the aluminum substrates 42, the double-sided copper foil substrate is a flexible copper foil thermally conductive substrate 41, and the flexible copper foil thermally conductive substrate is composed of a first copper foil layer 481, an insulating polymer layer 471, and a thermally conductive adhesive layer dispersed with heat dissipation powder. layer 472 and a second copper foil layer 482, the insulating polymer layer 471 is located between the first copper foil layer 481 and the thermally conductive adhesive layer 472, and the thermally conductive adhesive layer 472 is located on the insulating polymer layer 471 and the second copper foil layer 482, the flexible copper foil heat conduct...

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Abstract

The invention discloses a heat-dissipating aluminum-based circuit board which is formed by press fit of a double-faced copper clad laminate, a dielectric layer and an aluminum substrate. The double-faced copper clad laminate is a flexible copper foil heat-conductive substrate composed of a first foil layer, an insulating polymer layer, a heat-conductive adhering layer with dispersed heat-dissipating powder and a second foil layer. The dielectric layer is positioned between the second copper foil layer of the flexible copper foil heat-conductive substrate and the aluminum substrate. High heat conduction efficiency and high insulation breakdown voltage can be achieved while the overall thickness of the flexible copper foil heat-conductive substrate is reduced, and heat impedance of the flexible copper foil heat-conductive substrate is smaller than that of double-faced plates of T-preg, FR-4 and the like, so that the heat-dissipating aluminum-based circuit board has the advantages of simple structure, small overall thickness, low production cost, high heat conduction efficiency, low heat impedance and good insulation performance.

Description

technical field [0001] The invention relates to an aluminum-based circuit board, in particular to a heat-dissipating aluminum-based circuit board. Background technique [0002] With the rising awareness of global environmental protection, energy saving has become the current trend. The LED industry is one of the most watched industries in recent years. So far, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, usually only about 20% of the input power of high-power LED products can be converted into light, and the remaining 80% of the electrical energy is converted into heat energy. [0003] Generally speaking, if the heat energy generated when the LED emits light cannot be exported, the junction temperature of the LED will be too high, which will affect the product life cycle, luminous efficiency and stability. [0004] The traditional FR-4 al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/05H05K1/02
Inventor 张孟浩金进兴李建辉管儒光
Owner KUSN APLUS TEC CORP
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