Preparation method of polyamide hot melt adhesive with low surface energy for hot drills

A polyamide hot-melt adhesive, low surface energy technology, applied in the directions of adhesives, adhesive additives, non-polymer adhesive additives, etc. Good bonding strength, not easy to fall off

Inactive Publication Date: 2014-01-22
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the products introduced in the above patents have modified the different properties of polyamide hot melt adhesives, the adhesive properties of the obtained products to low surface energy materials have not been improved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Put caprolactam 112.5g, nylon 66 salt 237.5g, decanediamine 163g, dodecanedioic acid 213g, stearic acid 2g, antioxidant 1010 2g in a 2000ml high-pressure reactor equipped with a thermometer, mechanical stirring and nitrogen inlet pipe. , silane coupling agent KH550 3g, water 250g. First replace the nitrogen twice, then slowly raise the temperature to 120°C, start stirring, and then continue to heat up to 250°C, during which the pressure is kept rising. When the temperature reaches 1.5MPa, keep the pressure between 1.5 and 1.6MPa. Keep at 250-260°C for 1.5 hours, and then slowly release the pressure to normal pressure for 1.5 hours, then normal pressure for 2-3 hours, and finally pressurize and discharge to obtain product P1. According to the test, the melt index of product P1 is 15g / 10min, and it does not fall off after 10 times of water washing.

Embodiment 2

[0026] Put caprolactam 112.5g, nylon 66 salt 237.5g, decanediamine 115.56g, polyetheramine (D-400) 74.97g, dodecanedioic acid into a 2000ml high-pressure reactor equipped with a thermometer, mechanical stirring and nitrogen gas inlet pipe 187.19g, stearic acid 2g, antioxidant 1010 2g, silane coupling agent KH550 3g, water 250g. First replace the nitrogen twice, then slowly raise the temperature to 120°C, start stirring, and then continue to heat up to 250°C, during which the pressure is kept rising. When the temperature reaches 1.5MPa, keep the pressure between 1.5 and 1.6MPa. Keep at 250-260°C for 1.5 hours, then slowly release the pressure to normal pressure for 1.5 hours, then pressurize for 2-3 hours, and finally pressurize and discharge to obtain product P2. The melt index of product P2 was tested to be 15g / 10min, and it did not fall off after 10 washes.

Embodiment 3

[0028] Put caprolactam 112.5g, nylon 66 salt 237.5g, decanediamine 115.56g, polyetheramine (D-400) 74.97g, dodecanedioic acid into a 2000ml high-pressure reactor equipped with a thermometer, mechanical stirring and nitrogen gas inlet pipe 187g, stearic acid 1.5g, antioxidant 1010 2g, silane coupling agent KH570 3g, water 250g. First replace the nitrogen twice, then slowly raise the temperature to 120°C, start stirring, and then continue to heat up to 250°C, during which the pressure is kept rising. When the temperature reaches 1.5MPa, keep the pressure between 1.5 and 1.6MPa. Keep at 250-260°C for 1.5 hours, then slowly release the pressure to normal pressure for 1.5 hours, then pressurize for 2-3 hours, and finally pressurize and discharge to obtain product P3. The melt index of product P3 was tested to be 38g / 10min, and it did not fall off after 10 washes.

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PUM

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Abstract

The invention discloses a preparation method of a polyamide hot melt adhesive with low surface energy for hot drills. The preparation method comprises the following steps: adding aliphatic dicarboxylic acids, aliphatic diamines, other diamines, C6-12 lactam, nylon 66 salt, a molecular weight regulator and a modifier into a high pressure reaction kettle; and carrying out polymerization reaction under a condition of a certain temperature and pressure to obtain a targeted product. The product is applicable to adhering materials with low surface energy and particularly applicable to adhering hot drills with low surface energy such as a resin drill.

Description

technical field [0001] The invention relates to a preparation method of a polyamide hot-melt adhesive for low-surface energy hot-drilling, which is particularly suitable for bonding low-surface-energy materials, such as resin hot-melts and the like. Background technique [0002] Dimer acid polyamide hot melt adhesive is a kind of dimeric unsaturated aliphatic or partially substituted dimer unsaturated fatty acid and aliphatic diamine through polycondensation reaction. [0003] Chinese patent CN1990810A discloses a high-melting point polyamide hot-melt adhesive and a preparation method thereof, which is prepared by combining polyamide hot-melt adhesive with ethylene-vinyl acetate copolymer and / or ethylene-acrylate. It is flexible as well as oil resistant. [0004] Chinese patent CN1357589A discloses a multi-purpose polyamide hot melt adhesive and its preparation method, which blends high molecular weight branched polyamide and medium and low molecular weight polyamide to obt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/36C09J177/06C09J177/02C09J11/06
Inventor 李哲龙朱万育施才财曾作祥沈艳
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
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