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High-efficiency heat transfer nano-copper material and preparation method thereof

A nano-copper, high-efficiency technology, applied in the field of high-efficiency heat transfer nano-copper and its preparation, can solve the problems of poor wear resistance, oxidation resistance and corrosion resistance, decreased thermal conductivity of copper materials, energy waste, etc., and achieve low cost , good hydrophilicity, simple and controllable process

Active Publication Date: 2015-10-28
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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AI Technical Summary

Problems solved by technology

However, there are still few studies on the enhancement of heat transfer on micro-nano-scale surfaces, and it is still in its infancy.
[0005] Pure copper and its alloys are widely used in industrial production, but their wear resistance, oxidation resistance and corrosion resistance are poor, and their surface usually needs to be protected, for example, coating a layer of smooth nickel on the surface of copper can Effectively improve the service stability of copper. However, due to the introduction of a nickel metal layer with poorer thermal conductivity than copper itself, it will inevitably lead to a decrease in the thermal conductivity of the copper itself, resulting in a great waste of energy. Therefore, the strengthening of nickel-plated copper The heat transfer ability of the surface has very important scientific research value and practical application value

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  • High-efficiency heat transfer nano-copper material and preparation method thereof
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  • High-efficiency heat transfer nano-copper material and preparation method thereof

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preparation example Construction

[0044] The preparation method of the copper material of the present invention mainly includes processes such as pretreatment of the substrate surface and electrochemical deposition, especially in the electrochemical deposition process, by controlling the experimental conditions such as the material concentration of the electrolyte, the deposition time, and the deposition current, copper can be realized. Controlling the structure of ultra-thin and super-wetting nano- or micro-nano composite porous nickel film on the surface of materials.

[0045] In a more preferred embodiment, the preparation method may include: taking the counter electrode, the working electrode mainly composed of copper and the reference electrode and placing them in a weakly acidic nickel salt electrolyte at 60°C to form a reducing system, and A certain reduction current is applied between the working electrode and the counter electrode to carry out the electrodeposition reaction of nickel on the copper surf...

Embodiment 1

[0062] (1) Carry out degreasing and polishing treatment on the surface of the copper sheet with a purity of 99.9% in an acidic solution at 60° C., then rinse it with ultrapure water, and dry it under high-purity nitrogen for later use. The degreasing polishing liquid used is an acidic polishing liquid, wherein the components and their volume ratios are respectively: acetic acid: phosphoric acid: nitric acid: water=13:13:2:2.

[0063] (2) Before electroplating, place the copper sheet in sulfuric acid or hydrochloric acid with a volume concentration of 20% to activate for 10-20 seconds, rinse it with ultrapure water, and then put it into the plating solution for electrodeposition reaction. The surface-treated copper sheet was used as the working electrode, the platinum sheet with a purity of 99.9% was used as the counter electrode, and the Ag / AgCl electrode was used as the reference electrode. The distance between the two electrodes is controlled to be 60mm, and the constant cur...

Embodiment 2

[0070] (1) Degrease the surface of the copper table in an acidic solution at 60°C, then rinse it with ultrapure water, and dry it under high-purity nitrogen for later use. The volume ratios of the components in the used acidic polishing liquid are: acetic acid: phosphoric acid: nitric acid: water = 13:13:2:2.

[0071] (2) Before electroplating, put the copper platform in sulfuric acid with a volume concentration of 20% to activate for 10-20s, then rinse it with ultrapure water, and put it into the plating solution for electroplating. A copper platform was used as the working electrode, a platinum sheet with a purity of 99.9% was used as the counter electrode, and an Ag / AgCl electrode was used as the reference electrode. The distance between the two electrodes was controlled to be 60 mm, and the constant current electrodeposition reaction was carried out in a constant temperature water bath at 60° C., the current was controlled at 100 mA, and the duration was 45 min. The elect...

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Abstract

The invention discloses a nanometer copper material capable of transferring heat with high efficiency, and a preparation method thereof. The surface of the nanometer copper material is coated with an ultra-thin nano or micro-nano composite porous nickel film with super wetting ability; the ultra-thin nano composite porous nickel film comprises a porous structure which is mainly made of nickel nano flowers; and the ultra-thin micro-nano composite porous nickel film comprises a porous structure which is mainly formed by accumulation of micron or nanometer nickel triangular sheets. The preparation method comprises following steps: a substrate is taken as working electrode; the working electrode, a counter electrode and a reference electrode are placed in a weak acid nickel salt electrolyte so as to form a reduction system; reduction current is provided between the working electrode and the counter electrode so as to realized nickel electro-deposition on the surface of the substrate; and then the ultra-thin nano or micro-nano composite porous nickel film is formed on the surface of the substrate. The ultra-thin nano or micro-nano composite porous nickel film is capable of increasing utilization stability of the nanometer copper material, and improving filmwise condensation heat transfer performance, boiling heat transfer performance and spray cooling heat dissipation performance of the nanometer copper material greatly. The formula of the electrode needed in the preparation method is simple; raw material are cheap and easily available; optional range of electroplating mode is wide; and the preparation method is suitable for industrialized large-scaled application.

Description

technical field [0001] The invention relates to a structure and a method for improving a heat transfer surface, in particular to a high-efficiency heat transfer nano-copper material and a preparation method thereof. Background technique [0002] With the rapid development of modern industry and the continuous consumption of non-renewable resources such as fossil energy, improving energy utilization efficiency has attracted more and more attention. In the utilization and transmission of energy, enhanced heat transfer plays an important role in improving energy utilization efficiency, reducing equipment investment and saving space. Especially in recent years, with the rapid development of aerospace technology, lasers and high-power equipment, the miniaturization and integration of electronic components has become the main development direction of modern electronic equipment. Therefore, the study of thermal management and heat transport at the microscale has become the key to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C25D5/48
Inventor 高雪峰胡玲罗雨婷
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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