Hydrous cutting fluid for slicing silicon ingot

Abstract

The present invention provides a cutting fluid which, in the step of cutting a silicon ingot, is superior to conventional products in the removal of processing heat, infiltrating property, inhibition of reaction between water and the silicon, and antifoaming property to thereby attain an improvement in cutting efficiency, and with which silicon wafers having satisfactory flatness are yielded. The accuracy of the processed surface can hence be kept high even under severe slicing conditions. The cutting fluid is a hydrous cutting fluid for silicon-ingot slicing, characterized by comprising a polyoxyalkylene adduct (A) of a compound (a) having 3-8 hydroxy groups, the adduct (A) being represented by general formula (1), and water as essential components, the polyoxyalkylene adduct (A) having an HLB of 6.0-20.0. R{O-(A1O)m-H}f (1) [In formula (1), R represents the residue formed by removing the hydroxyl groups from a compound having 3-8 hydroxy groups; (A1O) represents a C2-4 oxyalkylene; m, indicating the average number of moles of a C2-4 alkylene oxide which has added, is a number of 1-350; and f is an integer of 3-8.]

Description

technical field [0001] The invention relates to an aqueous cutting fluid used in cutting silicon ingots. More specifically, the present invention relates to an aqueous cutting fluid having high cooling performance, excellent permeability, inhibition of reaction between silicon and water, foam suppression, and flatness of silicon wafers. Background technique [0002] Slicing methods for slicing silicon ingots using wires are roughly classified into: (1) methods using abrasive slurry (slurry), which is formed by dispersing free abrasive particles in cutting fluid; And (2) a method using a fixed abrasive wire formed by fixing abrasive grains to the wire by electroplating or bonding with a resin, and an aqueous cutting fluid. [0003] In recent years, with regard to the aqueous cutting fluid used in the slicing method using fixed abrasive wires, in order to improve the cooling performance of the frictional heat generated during cutting, or to reduce the risk of ignition caused ...

AI Technical Summary

Problems solved by technology

[0009] However, there is a problem that the flatness of the silicon wafer surface generally deteriorates when the thickness of the silicon wafer is reduced or the slicing time is shortened.

[0010] Therefore, as a countermeasure, a method of adding an alkylene oxide adduct of an organic amine as a lubricating component has been proposed (for example, Patent Document 2), but the effect on the flatness level (level) corresponding to thinning has not yet been achieved. full

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