Composite phenolic building insulation board and manufacturing method thereof

Abstract

The invention discloses a composite type PF (Phenol Formaldehyde) building heat insulation board and a manufacturing method thereof, which belong to the field of a building heat insulation board and a manufacturing method. The composite type PF building heat insulation board comprises a PF foam heat insulation layer, a bonding layer, an inorganic material composite board layer and a protection surface layer, wherein the bonding layer is arranged between the PF foam heat insulation layer and the inorganic material composite board layer, and the inorganic material composite board layer is provided with the protection surface layer on the outer surface; the composite type PF building heat insulation board is characterized in that the thickness of the PF foam heat insulation layer is 20-100 mm, the thickness of the bonding layer is 0.1-1 mm, the thickness of the inorganic material composite board layer is 3-10 mm, the component weight ratio of raw materials of the PF foam heat insulation layer is that PF resin : a polyurethane dedicated surface active agent : a foaming agent : an active toughening agent = 100 : (1-5) : (1-10) : (1-15), and the bonding layer is a PF type polyurethane adhesive. The composite type PF building heat insulation board disclosed by the invention has the characteristics of flame resistance, low toxicity and high temperature resistance and good waterproof ventilating function, the bonding capacity with a bonding material is better, and the construction is easy.

Description

technical field [0001] The invention relates to a building insulation board and a manufacturing method thereof, in particular to a composite phenolic building insulation board and a manufacturing method thereof. Background technique [0002] Currently used building insulation materials, such as extruded boards, polystyrene boards, polystyrene particles, polyethylene highly foamed and other foam materials, although light in weight, have acceptable thermal insulation effects, but generally have the following disadvantages: flammable, Toxic smoke, poor temperature resistance; poor water absorption, easy to mildew in a humid environment and cause the wall to turn black; when the wall is insulated, the bond with the bonding material is poor, such as bonded gypsum The adhesiveness of the materials, cement mortar, etc. is poor, and a large number of grasping nails and anchor bolts are needed to fix them; the construction period is long and the construction procedures are complicate...

AI Technical Summary

Problems solved by technology

[0002] Currently used building insulation materials, such as extruded boards, polystyrene boards, polystyrene particles, polyethylene highly foamed and other foam materials, although light in weight, thermal insulation The heat insulation effect is acceptable, but the following disadvantages are common: flammable, toxic smoke, poor temperature resistance; poor water absorption, easy to mildew in a humid environment and cause the wall to turn black; when the wall is heat-insulated, Poor bonding with bonding materials, such as poor adhesion with bonding gypsum materials, cement mortar, etc., and a large number of grasping nails and anchor bolts are required to fix them; the construction period is long and the construction procedures are complicated; it cannot be combined with inorganic materials , metal, non-metal and textile fibers are continuously molded to produce composite panels

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