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Method for manufacturing anodic film of parts of integrated circuit manufacturing equipment

A technology for manufacturing equipment and integrated circuits, which is applied in the field of manufacturing the anode film of parts of integrated circuit manufacturing equipment, can solve problems affecting the performance of parts, etc., and achieve the effects of prolonging service life, high corrosion resistance, and reducing costs

Active Publication Date: 2016-01-20
湖州科秉电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thickness of the anode film on the existing market is generally more than 80 μm, and the voltage resistance performance exceeds 2000V. However, if the anode film of this thickness is coated on the surface of the parts of the integrated circuit manufacturing equipment, the performance of these parts will be affected.

Method used

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  • Method for manufacturing anodic film of parts of integrated circuit manufacturing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Choose an aluminum alloy plate with a length of 20cm, a width of 10cm, and a thickness of 1cm as the substrate of the anode film;

[0031] In the cleaning step, the substrate is put into an organic solution for surface cleaning, and the organic solution is a 99% isopropanol solution;

[0032] In the alkaline washing step, the substrate is put into a sodium hydroxide solution with a ratio of sodium hydroxide and water of 1:10 for alkaline washing;

[0033] Grinding step: grinding the surface of the substrate to remove uneven surface and make the surface of the substrate smooth;

[0034] In the roughening treatment step, a sandblasting machine is used to spray the surface of the substrate with glass sand as the abrasive, and the sandblasting pressure is controlled at 1kg / cm2. The surface of the substrate is subjected to fine roughening treatment to make the surface roughness of the substrate 0.9μm;

[0035] In the film formation step, the substrate is placed in an anode tank conta...

Embodiment 2

[0038] Choose an aluminum alloy plate with a length of 15cm, a width of 15cm, and a thickness of 1cm as the substrate of the anode film;

[0039] In the cleaning step, the substrate is put into an organic solution for surface cleaning, and the organic solution is a 99% isopropanol solution;

[0040] In the alkaline washing step, the substrate is put into a sodium hydroxide solution with a ratio of sodium hydroxide and water of 1:10 for alkaline washing;

[0041] Grinding step: grinding the surface of the substrate to remove uneven surface and make the surface of the substrate smooth;

[0042] The roughening treatment step is to use a sandblasting machine to spray the surface of the substrate with glass sand as an abrasive. The pressure of the sandblasting machine is controlled at 1kg / cm2, and the surface of the substrate is finely roughened to make the surface of the substrate rough. The degree is 1μm;

[0043] In the film formation step, the substrate is placed in an anode tank contai...

Embodiment 3

[0046] Choose an aluminum alloy plate with a length of 25cm, a width of 10cm, and a thickness of 1cm as the substrate of the anode film;

[0047] In the cleaning step, the substrate is put into an organic solution for surface cleaning, and the organic solution is an isopropanol solution with a concentration of 99%;

[0048] In the alkaline washing step, the substrate is put into a sodium hydroxide solution with a ratio of sodium hydroxide and water of 1:10 for alkaline washing;

[0049] Grinding step: grinding the surface of the substrate to remove uneven surface and make the surface of the substrate smooth;

[0050] In the roughening treatment step, a sandblasting machine is used to spray the surface of the substrate with glass sand as the abrasive, and the sandblasting pressure is controlled at 1kg / cm2. The surface of the substrate is subjected to fine roughening treatment to make the surface roughness of the substrate 0.8μm;

[0051] In the film formation step, the substrate is plac...

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Abstract

The invention discloses a manufacturing method for an anode film of a part of integrated circuit manufacturing equipment. The manufacturing method comprises the following steps of selecting a rectangular aluminum alloy plate as a substrate of an anode film; placing the substrate into an organic solution for surface washing; placing the substrate into a sodium hydroxide solution for alkaline washing; grinding the surface of the substrate; jetting the surface of the substrate to enable the surface roughness of the substrate to be smaller than 1mum; placing the substrate into an anode tank with a sulfuric acid solution with the concentration of 10%, introducing different currents to the sulfuric acid solution under the same voltage according to different stages, and carrying out anodic oxidation treatment on the substrate to form a film; and placing the anode film into 100-DEG C boiled water to carry out hole sealing treatment for 30-60min to obtain the anode film with the thickness of 50-60mum. The thinner anode film obtained by using the manufacturing method for the anode film, disclosed by the invention, achieves the high corrosion, voltage and wear resistance of a thick anode film, so that the aim of protecting the part is achieved.

Description

Technical field [0001] The invention relates to a method for manufacturing an anode film of a component of an integrated circuit manufacturing equipment. The anode film is specially coated on the outer surface of the component of the integrated circuit manufacturing equipment. Background technique [0002] The manufacturing process of integrated circuits is the result of a collection of many high-precision technologies, which is extremely important for the control of manufacturing conditions and the mastery of the status of production equipment. [0003] In the manufacturing process of integrated circuits, high-energy, corrosive, and special gases are used interchangeably, which will consume or damage the parts of production equipment, especially in etching manufacturing. When the consumption or damage of the parts of the production equipment reaches a certain level, it will have an impact on the stability control of the production equipment, and the damage will become more and mor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D11/08C25D11/16C25D11/18
Inventor 吕永照
Owner 湖州科秉电子科技有限公司
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