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Polishing material and polishing composition

A technology of abrasive materials and compositions, which is applied in the direction of polishing compositions containing abrasives, grinding devices, grinding machine tools, etc., and can solve problems such as insufficient satisfaction

Active Publication Date: 2013-11-20
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the polishing composition described in Patent Document 2 is used for polishing hard and brittle materials such as glass substrates, it cannot fully satisfy all the above requirements.

Method used

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  • Polishing material and polishing composition
  • Polishing material and polishing composition
  • Polishing material and polishing composition

Examples

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Embodiment Construction

[0019] One embodiment of the present invention will be described below.

[0020] The polishing composition of this embodiment contains an abrasive and water. The abrasive material contains zirconia particles. The polishing composition is suitable for use in polishing hard and brittle materials such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide, and indium phosphide.

[0021] The zirconia particles contained in the abrasive may be particles of crystalline zirconia such as cubic system, tetragonal system, and monoclinic system, or particles of amorphous zirconia. As the abrasive, tetragonal or monoclinic zirconia is preferable. Zirconia particles may also contain calcium, magnesium, hafnium, yttrium, silicon, and the like. Among them, the purity of the zirconia particles is preferably as high as possible, specifically, preferably 99% by mass or more, more preferably 99.5% by mass or more, even more pref...

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Abstract

Provided is a polishing composition which contains a polishing material and water. The polishing composition contains the polishing material in an amount of 0.1% by mass or more. The polishing material contains zirconium oxide particles. Each zirconium oxide particle has a specific surface area of 1-15 m2 / g. It is preferable that the zirconium oxide particles has a purity of 99% by mass or more. For example, the polishing composition is used for the purpose of polishing hard-brittle materials such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide and indium phosphide.

Description

technical field [0001] The present invention relates to an abrasive material used for grinding hard and brittle materials such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide, and indium phosphide, and an abrasive material for grinding combination. The invention also relates to a grinding method for hard and brittle materials and a manufacturing method for hard and brittle material substrates. Background technique [0002] For polishing compositions used for polishing substrates such as glass substrates for hard disks, glass substrates for liquid crystal display panels, and synthetic quartz substrates for photomasks, in order to improve the quality of the polished substrates, the quality of the polished substrates is strongly required. The surface roughness is small and there are few surface defects such as scratches on the polished substrate. In addition, in order to shorten the time required for the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00C09K3/14
CPCC09G1/02B24B37/044C09K3/1409C09K3/1463B24B37/00C09K3/14
Inventor 森永均山田英一玉井一诚石桥智明大津平石原直幸高桥洋平
Owner FUJIMI INCORPORATED
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