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High-temperature sheet-type tantalum capacitor and manufacturing method thereof

A technology of tantalum capacitors and manufacturing methods, which is applied in the direction of capacitors, electrolytic capacitors, capacitor parts, etc., can solve problems such as not being able to withstand high temperature working environments, and achieve the effects of small size, good high temperature resistance, and excellent and stable performance

Active Publication Date: 2013-10-23
ZHUZHOU HONGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the disadvantage that the existing chip tantalum capacitors cannot withstand high temperature working environment, and provide a chip tantalum capacitor that can withstand high temperature of 200°C and its manufacturing method. The capacitor has good high temperature resistance, Small size, excellent and stable performance

Method used

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  • High-temperature sheet-type tantalum capacitor and manufacturing method thereof
  • High-temperature sheet-type tantalum capacitor and manufacturing method thereof
  • High-temperature sheet-type tantalum capacitor and manufacturing method thereof

Examples

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Effect test

Embodiment 1

[0023] figure 1 and figure 2 A schematic diagram of the basic structure of the present invention is given. It can be seen from the accompanying drawings that the present invention is a chip-type solid electrolyte tantalum capacitor, which is basically the same in structure as the traditional chip-type solid electrolyte tantalum capacitor. The tantalum powder particles are designed to be pressed into shape, vacuum sintered to obtain the anode tantalum core 3, and then the tantalum pentoxide dielectric film is formed electrochemically, and then manganese dioxide is coated on it as the cathode, and finally the core block is assembled, and the epoxy resin 6 Molded plastic seals out the product. However, because it is a high-temperature product, a new manufacturing process has been adopted, as follows:

[0024] A. Anode design: choose tantalum metal powder with uniform particle size and large particle size, calculate the weight of tantalum powder according to the formation vol...

Embodiment 2

[0029] figure 1 and image 3A schematic diagram of a double-core structure of the present invention is given. The high-temperature chip tantalum capacitor includes a negative pole support plate 1, an adhesive silver paste 2, an anode tantalum core 3, a tantalum wire 4, a positive pole lead frame 5 and a high-temperature packaged Epoxy resin 6 on the outer layer of the chip tantalum capacitor, the negative plate 1 is connected to the anode tantalum core 3 by bonding silver paste 2, and the high temperature chip tantalum capacitor adopts a double-core structure, including two anode tantalum cores 3 and two tantalum wires 4 respectively connected to the two anode tantalum cores 3 , the two anode tantalum cores 3 are bonded together with silver paste 2 , and the two tantalum wires 4 are spot-welded on the positive lead frame 5 side by side.

[0030] The working principle and production method of the second embodiment are the same as those of the first embodiment, except that the ...

Embodiment 3

[0032] figure 1 and Figure 4 A schematic diagram of another multi-core structure of the present invention is given. The high-temperature chip tantalum capacitor includes a negative plate 1, an adhesive silver paste 2, an anode tantalum core 3, a tantalum wire 4, a positive lead frame 5 and a packaged at high temperature. Epoxy resin 6 on the outer layer of the chip tantalum capacitor, the negative plate 1 is connected to the anode tantalum core 3 by bonding the silver paste 2, and the high temperature chip tantalum capacitor adopts a multi-core structure, including three (also can It is more than three) anode tantalum cores 3 and three (or more than three) tantalum wires 4 respectively connected to the anode tantalum cores 3, the anode tantalum cores 3 are all connected together by bonding silver paste 2, and the tantalum wires 4 are all Parallel spot welding on the positive electrode lead frame 5 .

[0033] The working principle and production method of the third embodimen...

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Abstract

The invention discloses a high-temperature sheet-type tantalum capacitor and a manufacturing method of the high-temperature sheet-type tantalum capacitor. The manufacturing method of the high-temperature sheet-type tantalum capacitor comprises the steps that an anode is designed, namely, the weight of tantalum powder is calculated according to formation voltage which is 2-6 times of the nominal voltage, and a porous matrix anode tantalum core is formed through sintering; dielectric film is formed, namely, aqueous solution with electrolyte being boric acid or nitric acid or phosphoric acid or ammonium dihydrogen phosphate or ethylene glycol is selected as formation solution, and tantalum pentoxide dielectric film which is uniform in thickness and good in uniformity is formed on the surface of the anode tantalum core; a manganese dioxide cathode is manufactured, namely, the anode tantalum core is put into manganous nitrate with different proportions, repeated operation is conducted, and a manganese dioxide cathode layer is formed; the high-temperature sheet-type tantalum capacitor is assembled. The high-temperature sheet-type tantalum capacitor can resist high temperature of 200 DEG C, has good high-temperature-resisting capacity, and is small in size, good and stable in performance, and capable of being widely applied to the fields of power supply control parts of airplane noses or guided missiles or the like and the fields of petroleum drilling electronic circuits and the like.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a high-temperature chip tantalum capacitor and a manufacturing method thereof. Background technique [0002] At present, with the rapid development of science and technology, human beings are exploring the interior of the earth and outer space more and more deeply, which puts forward higher requirements for electronic components, and chip tantalum capacitors are an important branch of tantalum electrolytic capacitors. , widely used in mobile communications, program-controlled switches, notebook computers, handheld computers, business communications, computers, camcorders, automotive electronics and other small electronic equipment surface mount equipment, but also in aviation, aerospace, marine ( In terms of ground cables, communications, oil drilling, etc., ultra-thin, large capacity, low equivalent series resistance, high frequency, high temperature, and high reliability a...

Claims

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Application Information

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IPC IPC(8): H01G9/042H01G9/07H01G9/08H01G9/26
Inventor 易金锋李俊伟
Owner ZHUZHOU HONGDA ELECTRONICS
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