LED display unit module

Abstract

The invention relates to an LED display unit module which comprises a packaging substrate, a wafer support, a bonding layer, an interface device, a plurality of LED chips, an application-specific integrated circuit chip, a heat dissipating layer and a heat dissipating cover plate, wherein the packaging substrate is arranged inside the wafer support, the top surface and the bottom surface of the packaging substrate are used for loading a plurality of reversed LED chips and reversed application-specific integrated circuit chip, the LED chips are electrically connected with the packaging substrate through the bonding layer; the application-specific integrated circuit chip is electrically connected with the packaging substrate through the ball grid array BGA technology or the bonding layer; the LED chips are electrically connected with the application-specific integrated circuit chip through the packaging substrate; the heat dissipating cover plate is fixed on the outer side of the application-specific integrated circuit chip through the heat dissipating layer and is especially used for heat dissipating of the application-specific integrated circuit chip; the interface device is arranged in the chip support between the bottom surface of the packaging substrate and the heat dissipating cover plate, is exposed through an opening formed in the heat dissipating cover plate, and is used for electrical connection between the packaging substrate and the external circuit.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an LED display unit module. Background technique [0002] In the past ten years, there have been two directional changes in the display field. Around 2000, the cathode ray tube (CRT) industry faced a crisis of substitution. After that, the mainstream direction tends to plasma display (PDP) and thin film transistor liquid crystal display (TFT-LCD). After more than 10 years of development, TFT-LCD has become the mainstream in the display field. Then, with the advancement of TFT-LCD and electroluminescence (EL) technology, active organic light-emitting display (AMOLED) also began to be industrialized. In addition, new display technologies such as Flexible Display and Laser Display continue to emerge. At present, a new round of debate about the development direction of the display industry has begun again. No matter from the perspective of TFT-LCD or AMOLED development, we can clea...

AI Technical Summary

Problems solved by technology

[0004] However, the traditional LED display technology has a bottleneck in the high-density field

Because it is limited by the traditional structure of the LED light source and the material structure involved in the post-integration processing module, such as the driving capacity and structure of the traditional constant current source package, the loose material of the traditional FR4 PCB board brings the integrated product. The problem of thermal stability, flatness and strength, as well as the injection molded mask and molded case required for installation and splicing into a large screen, etc., all severely limit the application of LED display technology in the high-density field, especially in the display with a pixel pitch of less than 1.0mm. breakthroughs and applications

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