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A kind of phenyl vinyl silicone resin for LED encapsulation and preparation method thereof

A phenylvinyl silicon, LED packaging technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of difficult to meet application requirements, poor impact resistance, large internal stress, etc., and achieve excellent thermal shock resistance. , good tensile strength, fast vulcanization effect

Active Publication Date: 2015-12-23
SHENZHEN CITY SQUARE SILICONE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the LED packaging material prepared with the above-mentioned phenyl silicone resin has excessive internal stress after vulcanization with the crosslinking agent, poor impact resistance, and it is difficult to meet the application requirements, and some products are solid at room temperature, which is difficult to adapt to modern LED packaging technology. requirements

Method used

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  • A kind of phenyl vinyl silicone resin for LED encapsulation and preparation method thereof
  • A kind of phenyl vinyl silicone resin for LED encapsulation and preparation method thereof

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preparation example Construction

[0025] The present invention also provides a preparation method of the above-mentioned phenyl vinyl silicone resin for LED packaging, which comprises the following steps:

[0026] Mix 1-100 parts by mass of phenylalkoxysilane monomer, 10-50 parts of organic solvent and 20-40 parts of water, and add 0.1-10% of the mass of phenylalkoxysilane monomer dropwise acid catalyst, reacted at 0-30°C for 1-8 hours to obtain reaction solution A;

[0027] Add at least one of alkoxy-terminated polydimethylsiloxane, polymethylphenylsiloxane, and polydimethyldiphenylsiloxane to the reaction solution A, and continue the reaction for 3- After 10 hours, add vinyl capping agent and react for 1 to 3 hours to obtain reaction solution B;

[0028] The reaction solution B is allowed to stand for stratification, after removing the acid solution in the upper layer, adding alkali to adjust the pH value to neutral, and washing to obtain a mixture;

[0029]The mixture is heated to 110° C. to 130° C. under...

Embodiment 1

[0039] In a 2L three-necked flask equipped with 100g of toluene and 50g of water, add 198g of phenyltrimethoxysilane, 244.4g of diphenyldimethoxysilane, and 18.2g of methylphenyldimethoxysilane at 30°C Add 30 parts of hydrochloric acid with a mass fraction of 25% dropwise, stir well, and finish the dropwise addition within one hour, then continue to stir for 2 to 3 hours, then add 76.3g of CH 3 O(CH 3 ) 2 Si[(OSi(CH 3 ) 2 )] 18 OSi(CH 3 ) 2 OCH 3 Polydimethylsiloxane, and 20g toluene, reacted for 1 hour, raised the temperature to 80°C, added 111.6g of tetramethyldivinyldisiloxane, kept the temperature at 80°C, stopped the reaction after 10 hours, cooled to Separate layers at room temperature, add 5g of sodium hydroxide to neutralize, wash with water until neutral, decompress for 3 hours at 110°C, vacuum degree of 0.9MPa ~ 1.0MPa, remove low boiling point substances, and obtain colorless and transparent phenyl Vinyl silicone resin 392.3g, viscosity 8000mPa.s / 25℃, refrac...

Embodiment 2

[0041] In a 2L three-necked flask equipped with 100g toluene and 50g water, add 198g phenyltrimethoxysilane, 488.8g diphenyldimethoxysilane, 9.1g methylphenyldimethoxysilane, and then Add 30 parts of hydrochloric acid with a mass fraction of 25% dropwise, stir well, and finish the dropwise addition within one hour, then continue to stir for 2 to 3 hours, then add 43g of CH 3 O(CH 3 ) 2 Si[(OSi(CH 3 ) 2 )] 9 OSi(CH 3 ) 2 OCH 3 Polydimethylsiloxane and 20g of toluene, react for 1 hour, heat up to 80°C, add 223.2g of tetramethyldivinyldisiloxane, keep the temperature at 80°C, stop the reaction after 10 hours, cool to room temperature Then separate layers, add 5g of sodium hydroxide to neutralize, wash with water until neutral, depressurize for 3 hours at 110°C and vacuum degree of 0.9MPa~1.0MPa, remove low boiling point substances, and obtain colorless transparent phenylethylene Base silicone resin 392.3g, viscosity 3000mPa.s / 25℃, refractive index 1.5401 / 20℃, vinyl conten...

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Abstract

The invention relates to the technical field of polymer materials and provides phenyl vinyl silicone resin for packaging an LED (light-emitting diode). The phenyl vinyl silicone resin comprises an inner core and a flexible chain segment which is cross-linked outside the inner core, wherein the inner core is a phenyl alkoxysilane polymer, and the flexible chain segment is at least one of vinyl-terminated polydimethylsiloxane, vinyl-terminated poly(methyl phenyl siloxane) and vinyl-terminated polydimethyl diphenyl siloxane. The invention further provides a preparation method of the phenyl vinyl silicone resin for packaging the LED. The method has the advantages of mild process conditions, simplicity and easiness in operation, wide range of sources of raw materials and good repeatability, and a product obtained after curing of the prepared phenyl vinyl silicone resin has the advantages of better tensile strength, hardness and other mechanical properties.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a phenyl vinyl silicone resin for LED packaging and a preparation method thereof. Background technique [0002] Power-type light-emitting diode (Light Emitting Diode, LED) is a device that directly converts electrical energy into light energy. Compared with traditional light sources such as incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps, the energy consumption is only 1 / 10 of traditional light sources. With the advantages of energy saving, environmental protection, safety, low heat, waterproof, shockproof, light weight, long life, high brightness, etc., it is known as the new light source in the 21st century. Vehicle lighting, logo lighting, landscape lighting, large-area graphic display full-color screen, etc. [0003] The traditional LED packaging materials are bisphenol A type or polyacrylic acid type transparent epoxy resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/44C08G77/20H01L33/56
Inventor 李彦民罗建立
Owner SHENZHEN CITY SQUARE SILICONE MATERIALS
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