Laser processing method and system assisted by water jet and gas jet

Abstract

The invention discloses a laser processing method and system assisted by a water jet and a gas jet. According to the laser processing method, a laser beam is focused on the surface of a workpiece; a gas jet beam of which the diameter is greater than that of the focus point of the laser beam is coaxial with the laser beam; after the gas jet beam enters a cut slot, a water jet beam behind the gas jet beam also enters the cut slot. The center line of the water jet beam is in a plane formed by the center line of the laser beam and the cut slot; the intersection point of the center line of the water jet beam and the surface of the workpiece is 1-2 mm from the focus point of the laser beam. The system comprises a laser generating mechanism, a gas jet nozzle and a workbench, wherein the longitudinal center line of the jet hole of a water jet nozzle behind the gas jet nozzle is in the plane formed by the center line of the laser beam and the cut slot; a gas pump and a water pump are respectively connected with the gas jet nozzle and the water jet nozzle; water circulates through the water pump, the water jet nozzle, a working cavity above the workbench and a water tank. According to the invention, the water jet beam restrains gas expansion, reduces the heat effect of laser, takes away deposits, and improves the efficiency and quality of laser ablation, so that the invention achieves remarkable effects particularly in processing plates with thicknesses above 15 mm.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a water jet and airflow compound-assisted laser processing method and system for improving laser processing efficiency. Background technique [0002] Laser processing is suitable for most materials and has the advantages of non-contact, flexibility and precision. However, for some applications in the field of micron and submicron etching, the heat-affected zone, deposition and impact damage effects caused by laser direct etching cannot be ignored. For this reason, in the current laser processing, the auxiliary gas injection is used to blow away the spatter generated by the laser direct engraving, and at the same time reduce the temperature of the laser processing area. However, when the depth of laser etching process is increased, the amount of air flow of the gas nozzle entering the cutting seam is significantly reduced, thus greatly reducing the efficiency...

AI Technical Summary

Problems solved by technology

However, when the depth of laser etching process is increased, the amount of air flow of the gas nozzle entering the cutting seam is significantly reduced, thus greatly reducing the efficiency of the gas nozzle, and cannot effectively remove the debris generated by laser etching and cool down. Directly affect the laser etching efficiency and processing quality, for example, the workpiece will produce recast layer, residual stress and micro cracks, etc.

Therefore, the current laser processing kerf depth is less than 10mm, which cannot be used for cutting larger thickness plates

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